Research graph
References from New Reconfigurable Fiber–Chip Coupling Method for Multipurpose Packaging with up to 50 GHz Modulation Bandwidth. Local targets link to admitted publications; unresolved targets remain external evidence.
Laser micro welding am micro melting for connection of optoelectronic micro-components
1994 · External reference
Optical components—the new challenge in packaging
10.1109/33.62521 · 1990 · External reference
Trends in Laserpackaging
1990 · External reference
Micropackaging technologies for optoelectronic components
1997 · External reference
An automated fiber alignment, fixing and hermetic sealing system
1988 · External reference
Unresolved reference
External reference
Optic/millimeter-wave converter for 60 GHz radio-over-fiber systems
1997 · External reference
Ultrafast monolithic InP-based photoreceiver module detecting a 40 Gbit/s optical TDM RZ modulated pulse sequence
1997 · External reference
Unresolved reference
1998 · External reference
Unresolved reference
External reference
