Research graph
References from A closed hybrid electronics cooling device using liquid synthetic jet and phase change material. Local targets link to admitted publications; unresolved targets remain external evidence.
Worldwide electricity used in data centers
10.1088/1748-9326/3/3/034008 · 2008 · External reference
Unresolved reference
1965 · External reference
A critical review of traditional and emerging techniques and fluids for electronics cooling
2017 · External reference
Standby and active leakage current control and minimization in CMOS VLSI circuits
10.1093/ietele/e88-c.4.509 · 2005 · External reference
Physical limits in semiconductor electronics
10.1126/science.195.4283.1230 · 1977 · External reference
Thermal modeling, analysis, and management in VLSI circuits: principles and methods
10.1109/jproc.2006.879797 · 2006 · External reference
Thermal issues in next-generation integrated circuits
10.1109/tdmr.2004.840160 · 2004 · External reference
Recent advances in thermal interface materials for thermal management of high-power electronics
10.3390/nano12193365 · 2022 · External reference
Unresolved reference
2020 · External reference
Phase change materials for thermal management and energy storage: a review
10.1016/j.est.2022.105602 · 2022 · External reference
Cooling of mobile electronic devices using phase change materials
10.1016/j.applthermaleng.2003.09.005 · 2004 · External reference
Experimental and numerical investigation of a phase change material: thermal-energy storage and release
10.1016/j.apenergy.2011.01.036 · 2011 · External reference
Thermal performance of pin fin heat sinks with phase change material for electronic devices thermal management
10.1016/j.applthermaleng.2024.123456 · 2024 · External reference
Heat pipe for cooling of electronic equipment
10.1016/j.enconman.2008.05.002 · 2008 · External reference
Unresolved reference
2016 · External reference
Investigation of PCM-assisted heat pipe for electronic cooling
10.1016/j.applthermaleng.2017.08.109 · 2017 · External reference
Optimization and comprehensive evaluation of liquid cooling tank for single-phase immersion cooling data center
10.1016/j.applthermaleng.2024.122864 · 2024 · External reference
Unresolved reference
2022 · External reference
Performance evaluation and optimization of data center servers using single-phase immersion cooling
10.1016/j.ijheatmasstransfer.2023.125057 · 2024 · External reference
Numerical simulation of plate fin heat sinks filled with low-melting metal PCM for high heat flux chips
10.1016/j.est.2025.117524 · 2025 · External reference
Unresolved reference
2016 · External reference
Experimental investigation of multiwall carbon nanotube/paraffin based heat sink for electronic device thermal management
10.1016/j.enconman.2018.10.037 · 2019 · External reference
Numerical investigations of using carbon foam/PCM/Nano carbon tubes composites in thermal management of electronic equipment
10.1016/j.enconman.2014.10.045 · 2015 · External reference
Phase change material/heat pipe and copper foam-based heat sinks for thermal management of electronic systems
10.1016/j.est.2020.101971 · 2020 · External reference
Unresolved reference
2023 · External reference
Thermally conductive shape-stabilized phase change materials enabled by paraffin wax and nanoporous structural expanded graphite
10.3390/nano15020110 · 2025 · External reference
Unresolved reference
2022 · External reference
Synthetic jet integrated in phase change material based heat sink: a novel compact thermal management device for electronic cooling
10.1016/j.enconman.2025.120741 · 2026 · External reference
Optimal thermal operation of liquid-cooled electronic chips
10.1016/j.ijheatmasstransfer.2011.11.052 · 2012 · External reference
Energy efficient hotspot-targeted embedded liquid cooling of electronics
10.1016/j.apenergy.2014.10.068 · 2015 · External reference
Critical heat flux: performance of R1234yf, R1234ze and R134a in an aluminum multi-minichannel heat sink at high saturation temperatures
10.1016/j.ijthermalsci.2016.03.011 · 2016 · External reference
Critical heat flux in multi-microchannel copper elements with low pressure refrigerants
10.1016/j.ijheatmasstransfer.2009.09.047 · 2010 · External reference
A review of jet impingement cooling
10.1016/j.ijft.2023.100312 · 2023 · External reference
Unresolved reference
External reference
Unresolved reference
2021 · External reference
Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers
10.1016/j.icheatmasstransfer.2010.05.004 · 2010 · External reference
Unresolved reference
2023 · External reference
An experimental investigation on heat transfer characteristics of hot surface by using CuO-water nanofluids in circular jet impingement cooling
10.1115/1.4037396 · 2018 · External reference
Effect of nozzle shape on jet impingement heat transfer from a circular cylinder
10.1016/j.ijthermalsci.2015.04.011 · 2015 · External reference
Unresolved reference
External reference
Unresolved reference
2023 · External reference
Experimental study on a dual synthetic jets liquid cooling device
10.1016/j.apenergy.2024.123865 · 2024 · External reference
Unsteady flow and heat transfer behavior of impinging synthetic jets: a phase-locked synchronous measurement
10.1016/j.ijheatmasstransfer.2024.126029 · 2024 · External reference
Heat transfer characteristics of synthetic jet impingement cooling
10.1016/j.ijheatmasstransfer.2009.11.005 · 2010 · External reference
Numerical study of a liquid cooling device based on dual synthetic jets actuator
10.1016/j.applthermaleng.2022.119691 · 2023 · External reference
Influence of mass flux ratio on the evolution of coaxial synthetic jet
10.1063/5.0101727 · 2022 · External reference
Impingement heat transfer enhancement by focusing the jet from synthetic jet array
10.1016/j.icheatmasstransfer.2024.107306 · 2024 · External reference
Hybrid cooling system for electronics equipment during power surge operation
10.1109/tcpmt.2017.2756919 · 2018 · External reference
A novel synthetic jet based heat sink with PCM filled cylindrical fins for efficient electronic cooling
10.1016/j.est.2022.106376 · 2023 · External reference
The formation and evolution of synthetic jets
10.1063/1.869828 · 1998 · External reference
2-D numerical investigation of melting of an impure PCM in the arbitrary-shaped annuli
10.1016/j.ijthermalsci.2017.01.006 · 2017 · External reference
A review on phase change energy storage: materials and applications
10.1016/j.enconman.2003.09.015 · 2004 · External reference
A comprehensive study of properties of paraffin phase change materials for solar thermal energy storage and thermal management applications
10.1016/j.energy.2018.08.068 · 2018 · External reference
Thermal interaction between water and liquid paraffin wax inside an intertwined enclosure: the role of natural convection in design of latent heat storage units
10.1016/j.tsep.2023.102343 · 2024 · External reference
Numerical investigation of heat transfer characteristics of impinging synthetic jets with different waveforms
10.1016/j.ijheatmasstransfer.2018.04.120 · 2018 · External reference
Unresolved reference
2022 · External reference
Towards accurate boundary conditions for CFD models of synthetic jets in quiescent flow
2020 · External reference
Formation criterion for synthetic jets
10.2514/1.12033 · 2005 · External reference
Orifice on oscillating diaphragm based compact synthetic jet actuator for enhanced thermal management
10.1016/j.enconman.2026.121585 · 2026 · External reference
Effects of the stroke length and nozzle-to-plate distance on synthetic jet impingement heat transfer
10.1016/j.ijheatmasstransfer.2017.09.118 · 2018 · External reference
Experimental and numerical investigation of a phase change material: thermal-energy storage and release
10.1016/j.apenergy.2011.01.036 · ExternalCitation · doi-reference
Energy efficient hotspot-targeted embedded liquid cooling of electronics
10.1016/j.apenergy.2014.10.068 · ExternalCitation · doi-reference
Experimental study on a dual synthetic jets liquid cooling device
10.1016/j.apenergy.2024.123865 · ExternalCitation · doi-reference
Cooling of mobile electronic devices using phase change materials
10.1016/j.applthermaleng.2003.09.005 · ExternalCitation · doi-reference
Investigation of PCM-assisted heat pipe for electronic cooling
10.1016/j.applthermaleng.2017.08.109 · ExternalCitation · doi-reference
Numerical study of a liquid cooling device based on dual synthetic jets actuator
10.1016/j.applthermaleng.2022.119691 · ExternalCitation · doi-reference
Optimization and comprehensive evaluation of liquid cooling tank for single-phase immersion cooling data center
10.1016/j.applthermaleng.2024.122864 · ExternalCitation · doi-reference
Thermal performance of pin fin heat sinks with phase change material for electronic devices thermal management
10.1016/j.applthermaleng.2024.123456 · ExternalCitation · doi-reference
A review on phase change energy storage: materials and applications
10.1016/j.enconman.2003.09.015 · ExternalCitation · doi-reference
Heat pipe for cooling of electronic equipment
10.1016/j.enconman.2008.05.002 · ExternalCitation · doi-reference
Numerical investigations of using carbon foam/PCM/Nano carbon tubes composites in thermal management of electronic equipment
10.1016/j.enconman.2014.10.045 · ExternalCitation · doi-reference
Experimental investigation of multiwall carbon nanotube/paraffin based heat sink for electronic device thermal management
10.1016/j.enconman.2018.10.037 · ExternalCitation · doi-reference
Synthetic jet integrated in phase change material based heat sink: a novel compact thermal management device for electronic cooling
10.1016/j.enconman.2025.120741 · ExternalCitation · doi-reference
Orifice on oscillating diaphragm based compact synthetic jet actuator for enhanced thermal management
10.1016/j.enconman.2026.121585 · ExternalCitation · doi-reference
A comprehensive study of properties of paraffin phase change materials for solar thermal energy storage and thermal management applications
10.1016/j.energy.2018.08.068 · ExternalCitation · doi-reference
Phase change material/heat pipe and copper foam-based heat sinks for thermal management of electronic systems
10.1016/j.est.2020.101971 · ExternalCitation · doi-reference
Phase change materials for thermal management and energy storage: a review
10.1016/j.est.2022.105602 · ExternalCitation · doi-reference
A novel synthetic jet based heat sink with PCM filled cylindrical fins for efficient electronic cooling
10.1016/j.est.2022.106376 · ExternalCitation · doi-reference
Numerical simulation of plate fin heat sinks filled with low-melting metal PCM for high heat flux chips
10.1016/j.est.2025.117524 · ExternalCitation · doi-reference
Investigation on the jet liquid impingement heat transfer for the central processing unit of personal computers
10.1016/j.icheatmasstransfer.2010.05.004 · ExternalCitation · doi-reference
Impingement heat transfer enhancement by focusing the jet from synthetic jet array
10.1016/j.icheatmasstransfer.2024.107306 · ExternalCitation · doi-reference
A review of jet impingement cooling
10.1016/j.ijft.2023.100312 · ExternalCitation · doi-reference
Critical heat flux in multi-microchannel copper elements with low pressure refrigerants
10.1016/j.ijheatmasstransfer.2009.09.047 · ExternalCitation · doi-reference
Heat transfer characteristics of synthetic jet impingement cooling
10.1016/j.ijheatmasstransfer.2009.11.005 · ExternalCitation · doi-reference
Optimal thermal operation of liquid-cooled electronic chips
10.1016/j.ijheatmasstransfer.2011.11.052 · ExternalCitation · doi-reference
Effects of the stroke length and nozzle-to-plate distance on synthetic jet impingement heat transfer
10.1016/j.ijheatmasstransfer.2017.09.118 · ExternalCitation · doi-reference
Numerical investigation of heat transfer characteristics of impinging synthetic jets with different waveforms
10.1016/j.ijheatmasstransfer.2018.04.120 · ExternalCitation · doi-reference
Performance evaluation and optimization of data center servers using single-phase immersion cooling
10.1016/j.ijheatmasstransfer.2023.125057 · ExternalCitation · doi-reference
Unsteady flow and heat transfer behavior of impinging synthetic jets: a phase-locked synchronous measurement
10.1016/j.ijheatmasstransfer.2024.126029 · ExternalCitation · doi-reference
Effect of nozzle shape on jet impingement heat transfer from a circular cylinder
10.1016/j.ijthermalsci.2015.04.011 · ExternalCitation · doi-reference
Critical heat flux: performance of R1234yf, R1234ze and R134a in an aluminum multi-minichannel heat sink at high saturation temperatures
10.1016/j.ijthermalsci.2016.03.011 · ExternalCitation · doi-reference
2-D numerical investigation of melting of an impure PCM in the arbitrary-shaped annuli
10.1016/j.ijthermalsci.2017.01.006 · ExternalCitation · doi-reference
Thermal interaction between water and liquid paraffin wax inside an intertwined enclosure: the role of natural convection in design of latent heat storage units
10.1016/j.tsep.2023.102343 · ExternalCitation · doi-reference
The formation and evolution of synthetic jets
10.1063/1.869828 · ExternalCitation · doi-reference
Influence of mass flux ratio on the evolution of coaxial synthetic jet
10.1063/5.0101727 · ExternalCitation · doi-reference
Worldwide electricity used in data centers
10.1088/1748-9326/3/3/034008 · ExternalCitation · doi-reference
Standby and active leakage current control and minimization in CMOS VLSI circuits
10.1093/ietele/e88-c.4.509 · ExternalCitation · doi-reference
Thermal modeling, analysis, and management in VLSI circuits: principles and methods
10.1109/jproc.2006.879797 · ExternalCitation · doi-reference
Hybrid cooling system for electronics equipment during power surge operation
10.1109/tcpmt.2017.2756919 · ExternalCitation · doi-reference
Thermal issues in next-generation integrated circuits
10.1109/tdmr.2004.840160 · ExternalCitation · doi-reference
An experimental investigation on heat transfer characteristics of hot surface by using CuO-water nanofluids in circular jet impingement cooling
10.1115/1.4037396 · ExternalCitation · doi-reference
Physical limits in semiconductor electronics
10.1126/science.195.4283.1230 · ExternalCitation · doi-reference
Formation criterion for synthetic jets
10.2514/1.12033 · ExternalCitation · doi-reference
Recent advances in thermal interface materials for thermal management of high-power electronics
10.3390/nano12193365 · ExternalCitation · doi-reference
Thermally conductive shape-stabilized phase change materials enabled by paraffin wax and nanoporous structural expanded graphite
10.3390/nano15020110 · ExternalCitation · doi-reference
