Research graph
References from A heat-flux isolation-based decoupling and co-optimization framework for thermal management of high-power LEDs. Local targets link to admitted publications; unresolved targets remain external evidence.
LED thermal management: From fundamental mechanisms to deep learning-enabled multi-objective optimization for sustainable lighting
10.1016/j.rser.2026.116980 · 2026 · External reference
High-performance thermal management system for high-power LEDs based on double-nozzle spray cooling
10.1016/j.applthermaleng.2023.121005 · 2023 · External reference
Heat and fluid flow in high-power LED packaging and applications
10.1016/j.pecs.2016.05.003 · 2016 · External reference
Application of micro/nano technology for thermal management of high–power LED packaging – A review
10.1016/j.applthermaleng.2018.09.078 · 2018 · External reference
Thermal management of LEDs: package to system
2004 · External reference
Measuring and prognosis of remaining useful life of light-emitting diodes based on nonlinear fuzzy inference system
10.1016/j.measurement.2026.120322 · 2026 · External reference
Light emitting diode degradation and failure occurrence modelling based on accelerated life test
10.1016/j.engfailanal.2024.109200 · 2025 · External reference
Parametric modeling and thermal optimization of novel bionic heat sinks inspired by leaf venation
10.1016/j.ijheatmasstransfer.2025.127940 · 2026 · External reference
Investigation of the cooling performance of a double-layer liquid-cooled plate with circular arc-shaped flow channels for thermal management of light-emitting diodes
10.1016/j.ijthermalsci.2023.108756 · 2024 · External reference
Improvement of heat sink cooling performance by optimizing geometrical parameters: role of fin number, height, and angle
10.1016/j.icheatmasstransfer.2025.109859 · 2025 · External reference
Heat-dissipation performance of cylindrical heat sink with perforated fins
10.1016/j.ijthermalsci.2021.107132 · 2021 · External reference
Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights
10.1016/j.enconman.2018.11.021 · 2019 · External reference
Experimental investigation on active heat sink with heat pipe assistance for high-power automotive LED headlights
10.1016/j.csite.2021.101503 · 2021 · External reference
Multi-objective optimization of a cylindrical heat sink with straight and forked fins using artificial neural network (ANN)
10.1016/j.icheatmasstransfer.2025.109082 · 2025 · External reference
Optimization of delta ribs in a microchannel heat sink using numerical analysis and Artificial Neural Networks
10.1016/j.csite.2025.107167 · 2025 · External reference
Residual-based physics-informed transfer learning: A hybrid method for accelerating long-term CFD simulations via deep learning
10.1016/j.ijheatmasstransfer.2023.124900 · 2024 · External reference
Computationally effective machine learning approach for modular thermal energy storage design
10.1016/j.apenergy.2024.124430 · 2025 · External reference
A Review of Data-Driven Models for Electromagnetic Devices Design and Analysis
10.1109/access.2025.3591965 · 2025 · External reference
Improved Cauer thermal network considering thermal coupling effects of multi-chip modules
10.1049/iet-pel.2020.0001 · 2020 · External reference
Decoupling compact thermal model in multi-chip IGBT modules: A methodology based on concepts of positive and negative mutual thermal coupling
10.1109/jestpe.2024.3377913 · 2024 · External reference
Frequency-domain thermal coupling model of multi-chip power module
10.1109/tpel.2023.3236250 · 2023 · External reference
A Method to Derive the Coupling Thermal Resistances at Junction-to-Case Level in Multichip Power Modules
10.1109/tpel.2022.3207140 · 2023 · External reference
Physics-based thermal impedance model for power module by analytic Fourier series based heat spreading angle
2022 · External reference
Lumped thermal coupling model of multichip power module enabling case temperature as reference node
10.1109/tpel.2022.3173653 · 2022 · External reference
A modeling method for thermal steady-state simulation of the four-layer printed circuit board
10.1371/journal.pone.0310237 · 2024 · External reference
A thermal network model for multichip power modules enabling to characterize the thermal coupling effects
10.1109/tpel.2024.3355207 · 2024 · External reference
Junction temperature prediction for multi-chip IGBT modules based on an improved 3D thermal network model and experimental results
10.1016/j.rineng.2025.106072 · 2025 · External reference
Three-dimensional multi-scale topology optimization of porous heat sink with predetermined unit cells for natural convection heat transfer
10.1016/j.ijheatmasstransfer.2024.125398 · 2024 · External reference
Experimental investigation of an additively manufactured cold plate for multi-chip module cooling generated using the homogenization approach to topology optimization
10.1016/j.applthermaleng.2024.124741 · 2025 · External reference
Thermo-electrochemical level-set topology optimization of a heat exchanger for lithium-ion batteries for electric vertical take-off and landing vehicles
10.1016/j.applthermaleng.2024.123461 · 2024 · External reference
Comparative study on topology optimization of microchannel heat sink by using different multi-objective algorithms and objective functions
10.1016/j.applthermaleng.2024.123606 · 2024 · External reference
Data-driven multi-fidelity topology design of fin structures for latent heat thermal energy storage
10.1016/j.apenergy.2024.124596 · 2025 · External reference
Data-driven multifidelity topology design for enhancing turbulent natural convection cooling
10.1016/j.ijheatmasstransfer.2024.126659 · 2025 · External reference
Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
10.1117/1.oe.57.2.025102 · 2018 · External reference
Computationally effective machine learning approach for modular thermal energy storage design
10.1016/j.apenergy.2024.124430 · ExternalCitation · doi-reference
Data-driven multi-fidelity topology design of fin structures for latent heat thermal energy storage
10.1016/j.apenergy.2024.124596 · ExternalCitation · doi-reference
Application of micro/nano technology for thermal management of high–power LED packaging – A review
10.1016/j.applthermaleng.2018.09.078 · ExternalCitation · doi-reference
High-performance thermal management system for high-power LEDs based on double-nozzle spray cooling
10.1016/j.applthermaleng.2023.121005 · ExternalCitation · doi-reference
Thermo-electrochemical level-set topology optimization of a heat exchanger for lithium-ion batteries for electric vertical take-off and landing vehicles
10.1016/j.applthermaleng.2024.123461 · ExternalCitation · doi-reference
Comparative study on topology optimization of microchannel heat sink by using different multi-objective algorithms and objective functions
10.1016/j.applthermaleng.2024.123606 · ExternalCitation · doi-reference
Experimental investigation of an additively manufactured cold plate for multi-chip module cooling generated using the homogenization approach to topology optimization
10.1016/j.applthermaleng.2024.124741 · ExternalCitation · doi-reference
Experimental investigation on active heat sink with heat pipe assistance for high-power automotive LED headlights
10.1016/j.csite.2021.101503 · ExternalCitation · doi-reference
Optimization of delta ribs in a microchannel heat sink using numerical analysis and Artificial Neural Networks
10.1016/j.csite.2025.107167 · ExternalCitation · doi-reference
Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights
10.1016/j.enconman.2018.11.021 · ExternalCitation · doi-reference
Light emitting diode degradation and failure occurrence modelling based on accelerated life test
10.1016/j.engfailanal.2024.109200 · ExternalCitation · doi-reference
Multi-objective optimization of a cylindrical heat sink with straight and forked fins using artificial neural network (ANN)
10.1016/j.icheatmasstransfer.2025.109082 · ExternalCitation · doi-reference
Improvement of heat sink cooling performance by optimizing geometrical parameters: role of fin number, height, and angle
10.1016/j.icheatmasstransfer.2025.109859 · ExternalCitation · doi-reference
Residual-based physics-informed transfer learning: A hybrid method for accelerating long-term CFD simulations via deep learning
10.1016/j.ijheatmasstransfer.2023.124900 · ExternalCitation · doi-reference
Three-dimensional multi-scale topology optimization of porous heat sink with predetermined unit cells for natural convection heat transfer
10.1016/j.ijheatmasstransfer.2024.125398 · ExternalCitation · doi-reference
Data-driven multifidelity topology design for enhancing turbulent natural convection cooling
10.1016/j.ijheatmasstransfer.2024.126659 · ExternalCitation · doi-reference
Parametric modeling and thermal optimization of novel bionic heat sinks inspired by leaf venation
10.1016/j.ijheatmasstransfer.2025.127940 · ExternalCitation · doi-reference
Heat-dissipation performance of cylindrical heat sink with perforated fins
10.1016/j.ijthermalsci.2021.107132 · ExternalCitation · doi-reference
Investigation of the cooling performance of a double-layer liquid-cooled plate with circular arc-shaped flow channels for thermal management of light-emitting diodes
10.1016/j.ijthermalsci.2023.108756 · ExternalCitation · doi-reference
Measuring and prognosis of remaining useful life of light-emitting diodes based on nonlinear fuzzy inference system
10.1016/j.measurement.2026.120322 · ExternalCitation · doi-reference
Heat and fluid flow in high-power LED packaging and applications
10.1016/j.pecs.2016.05.003 · ExternalCitation · doi-reference
Junction temperature prediction for multi-chip IGBT modules based on an improved 3D thermal network model and experimental results
10.1016/j.rineng.2025.106072 · ExternalCitation · doi-reference
LED thermal management: From fundamental mechanisms to deep learning-enabled multi-objective optimization for sustainable lighting
10.1016/j.rser.2026.116980 · ExternalCitation · doi-reference
Improved Cauer thermal network considering thermal coupling effects of multi-chip modules
10.1049/iet-pel.2020.0001 · ExternalCitation · doi-reference
A Review of Data-Driven Models for Electromagnetic Devices Design and Analysis
10.1109/access.2025.3591965 · ExternalCitation · doi-reference
Decoupling compact thermal model in multi-chip IGBT modules: A methodology based on concepts of positive and negative mutual thermal coupling
10.1109/jestpe.2024.3377913 · ExternalCitation · doi-reference
Lumped thermal coupling model of multichip power module enabling case temperature as reference node
10.1109/tpel.2022.3173653 · ExternalCitation · doi-reference
A Method to Derive the Coupling Thermal Resistances at Junction-to-Case Level in Multichip Power Modules
10.1109/tpel.2022.3207140 · ExternalCitation · doi-reference
Frequency-domain thermal coupling model of multi-chip power module
10.1109/tpel.2023.3236250 · ExternalCitation · doi-reference
A thermal network model for multichip power modules enabling to characterize the thermal coupling effects
10.1109/tpel.2024.3355207 · ExternalCitation · doi-reference
Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
10.1117/1.oe.57.2.025102 · ExternalCitation · doi-reference
A modeling method for thermal steady-state simulation of the four-layer printed circuit board
10.1371/journal.pone.0310237 · ExternalCitation · doi-reference
