Research graph
References from Insight into sequential multi-scratch interference mechanism on monocrystalline sapphire. Local targets link to admitted publications; unresolved targets remain external evidence.
Fractal characterization of surface complexity and anisotropic scratch evolution in sapphire polishing
10.1016/j.triboint.2025.111149 · 2026 · External reference
Tribo-chemical atom removal in sapphire chemical mechanical polishing: insight from ReaxFF MD and experiments
10.1016/j.triboint.2025.111088 · 2026 · External reference
Nanoscale ductility in c-plane Al2O3: dislocation and twinning mechanisms via nanoindentation and molecular dynamics
2026 · External reference
Monocrystalline sapphire stress field analysis with orthorhombic crystal orientation under vickers indentation
10.3390/ma18225136 · 2025 · External reference
Green chemical mechanical polishing of sapphire wafers utilizing h-BN assisted Al2O3 abrasives
2025 · External reference
Effects of polishing parameters on surface quality in sapphire double-sided CMP
10.1016/j.ceramint.2020.02.116 · 2020 · External reference
Anisotropy monitoring of ultra-precision grinding force and acoustic emission signal of monocrystalline sapphire
10.1016/j.measurement.2025.116835 · 2025 · External reference
Residual stress and subsurface damage in sapphire ultra-precision grinding
10.1016/j.jmatprotec.2024.118418 · 2024 · External reference
Biological in-process dressing (BID) performance of iron fixed abrasive pad in sapphire wafer lapping
10.1016/j.ceramint.2025.06.089 · 2025 · External reference
Lapping performance of agglomerated diamond abrasives and analysis of sapphire processing process
10.1016/j.precisioneng.2024.06.008 · 2024 · External reference
Mesoscale insight into damage evolution mechanism of fused silica induced by successive scratching
10.1016/j.triboint.2025.111347 · 2026 · External reference
Mechanistic study of 4H-SiC removal under various scratching speeds using nano-scratching experiments and molecular dynamics simulations
10.1016/j.triboint.2025.111230 · 2026 · External reference
Fundamental investigation on damage evolution and material removal anisotropic mechanism in monocrystal sapphire
10.1016/j.jmatprotec.2025.119052 · 2025 · External reference
Anisotropic mechanism of material removal and ductile-brittle transition in sapphire scratching based on acoustic emission signal
10.1016/j.jmrt.2024.07.017 · 2024 · External reference
Crystal-orientation-dependent nanoscale machining mechanisms in ultrasonic vibration-assisted scratching sapphire
10.1016/j.apsusc.2025.165069 · 2026 · External reference
Deformation anisotropy of nano-scratching on C-plane of sapphire: a molecular dynamics study and experiment
10.1016/j.apsusc.2021.149091 · 2021 · External reference
In-situ scratch characteristics of the A-plane and R-plane sapphires
10.1016/j.vacuum.2025.114937 · 2026 · External reference
R-plane monocrystalline sapphire surface damage evolution under single grit scratching
10.1016/j.jmrt.2026.01.077 · 2026 · External reference
Evolution of material removal modes of sapphire under varied scratching depths
10.1016/j.ceramint.2017.05.069 · 2017 · External reference
Dependence of material removal on crystal orientation of sapphire under cross scratching
10.1016/j.jeurceramsoc.2017.01.032 · 2017 · External reference
Ultrasonic vibration-assisted scratch-induced characteristics of C-plane sapphire with a spherical indenter
10.1016/j.ijmachtools.2012.07.009 · 2013 · External reference
Understanding the damage evolution of sapphire under scratching from AE signals
10.1016/j.ceramint.2020.07.103 · 2020 · External reference
Effect of laser-assisted heat treatment on material removal behavior of sapphire in indentation and scratching
10.1016/j.mssp.2024.108630 · 2024 · External reference
Nanoscale indentation and scratching tests of single crystal sapphire using molecular dynamics simulation
10.1016/j.commatsci.2019.109195 · 2019 · External reference
Coupling of double grains enforces the grinding process in vibration-assisted scratch: insights from molecular dynamics
10.1016/j.jmatprotec.2022.117551 · 2022 · External reference
Interaction of lateral cracks in double scratching of single-crystal silicon carbide
10.1016/j.tafmec.2019.102378 · 2019 · External reference
Analysis of grit interference mechanisms for the double scratching of monocrystalline silicon carbide by coupling the FEM and SPH
10.1016/j.ijmachtools.2017.04.012 · 2017 · External reference
Material removal mechanism and crack propagation in single scratch and double scratch tests of single-crystal silicon carbide by abrasives on wire saw
10.1016/j.ceramint.2018.09.178 · 2019 · External reference
Analysis of crack initiation load and stress field in double scratching of single crystal gallium nitride
10.1016/j.engfracmech.2022.108732 · 2022 · External reference
Subsurface damage model in single and double scratching of fused silica with a blunt indenter
10.1016/j.ijmecsci.2023.108309 · 2023 · External reference
Scratch with double-tip tool: crack behavior during simultaneous double scratch on BK7 glass
10.1016/j.jeurceramsoc.2020.04.008 · 2020 · External reference
Unique crack behaviors of glass BK7 occurred in successive double scratch under critical load of median crack initiation
10.1016/j.jeurceramsoc.2020.02.049 · 2020 · External reference
Material removal of optical glass BK7 during single and double scratch tests
10.1016/j.wear.2010.10.064 · 2011 · External reference
Evolutionary mechanism of ultrasonic crack propagation based on double-grain scratching and stress field analysis
10.1016/j.ceramint.2025.08.397 · 2025 · External reference
Grinding forces in micro slot-grinding (MSG) of single crystal sapphire
10.1016/j.ijmachtools.2016.10.004 · 2017 · External reference
An analytical model for estimation of the stress field and cracks caused by scratching anisotropic single crystal gallium nitride
10.1016/j.mssp.2020.105446 · 2021 · External reference
Analytical modeling of the stress field in scratching anisotropic single-crystal silicon
10.1016/j.mssp.2022.107099 · 2022 · External reference
Crack extension mechanism and scratch stress field model of hard and brittle materials caused by curvature effect
10.1016/j.jmatprotec.2023.118058 · 2023 · External reference
Understand anisotropy dependence of damage evolution and material removal during nanoscratch of MgF2 single crystals
10.1088/2631-7990/ac9eed · 2023 · External reference
Fundamental investigation on damage evolution and material removal mechanism in scratching anisotropic brittle material
10.1016/j.triboint.2024.109764 · 2024 · External reference
Direct observation and analysis of indentation cracking in glasses and ceramics
10.1111/j.1151-2916.1990.tb05119.x · 1990 · External reference
The effect of anisotropy on the deformation and fracture of sapphire wafers subjected to thermal shocks
10.1016/j.jmatprotec.2007.03.125 · 2007 · External reference
The anisotropy of surface deformation of sapphire: continuous indentation of triangular indenter
10.1016/0956-7151(94)90229-1 · 1994 · External reference
Using vibration-assisted grinding to reduce subsurface damage
10.1016/s0141-6359(00)00043-x · 2000 · External reference
Effect of ultrasonic elliptical vibration assistance on the surface layer defect of M-plane sapphire in microcutting
10.1016/j.matdes.2020.108755 · 2020 · External reference
Strain-rate dependence of surface/subsurface deformation mechanisms during nanoscratching tests of GGG single crystal
10.1016/j.ceramint.2019.04.238 · 2019 · External reference
Deformation characteristics and surface generation modelling of crack-free grinding of GGG single crystals
10.1016/j.jmatprotec.2019.116577 · 2020 · External reference
Experimental study on brittle–ductile transition in elliptical ultrasonic assisted grinding (EUAG) of monocrystal sapphire using single diamond abrasive grain
10.1016/j.ijmachtools.2013.04.004 · 2013 · External reference
Theoretical approach on the critical depth of cut of single crystal MgF2 and application to a microcavity
10.1016/j.precisioneng.2021.09.002 · 2022 · External reference
