Research graph
References from Precision depth metrology of high-aspect-ratio through-silicon vias using electro-optic dual-comb time-of-flight ranging. Local targets link to admitted publications; unresolved targets remain external evidence.
An overview of through-silicon-via technology and manufacturing challenges
10.1016/j.mee.2014.10.019 · 2015 · External reference
Metrology for the next generation of semiconductor devices
10.1038/s41928-018-0150-9 · 2018 · External reference
A short review of through-silicon via (TSV) interconnects: metrology and analysis
10.3390/app13148301 · 2023 · External reference
A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor packaging
10.1115/1.4069965 · 2025 · External reference
On the Importance of Metrological Traceability in Nanomanufacturing
10.1007/s41871-025-00247-y · 2025 · External reference
3D measurement of TSVs using low numerical aperture white-light scanning interferometry
10.3807/josk.2013.17.4.317 · 2013 · External reference
Characterization of high density through silicon vias with spectral reflectometry
10.1364/oe.19.005993 · 2011 · External reference
Machine learning–based 3D through-silicon via metrology for advanced packaging
10.1117/1.jmm.24.3.034003 · 2025 · External reference
In-line through silicon vias etching depths inspection by spectroscopic reflectometry
10.1016/j.mee.2014.03.007 · 2014 · External reference
Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias
10.1109/jlt.2016.2618419 · 2016 · External reference
Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process
10.1364/oe.20.005011 · 2012 · External reference
Electromagnetic analysis for optical coherence tomography based through silicon vias metrology
10.1364/ao.58.007472 · 2019 · External reference
Overcoming challenges in microhole dimensional metrology with optical coherence tomography
2025 · External reference
10.37188/lam.2025.074
10.37188/lam.2025.074 · External reference
20 years of developments in optical frequency comb technology and applications
10.1038/s42005-019-0249-y · 2019 · External reference
Optical frequency combs: Coherently uniting the electromagnetic spectrum
10.1126/science.aay3676 · 2020 · External reference
A comprehensive review of optical frequency-comb-based applications in surface metrology
2026 · External reference
Rapid and precise absolute distance measurements at long range
10.1038/nphoton.2009.94 · 2009 · External reference
Dual-comb ranging
10.1016/j.eng.2018.10.002 · 2018 · External reference
Long-distance and high-precision ranging with dual-comb nonlinear asynchronous optical sampling
10.1364/oe.527583 · 2024 · External reference
High-precision dual-comb ranging based on two-color nonlinear asynchronous optical sampling
10.1364/ol.575662 · 2025 · External reference
Electro-optic frequency combs
10.1364/aop.382052 · 2020 · External reference
Electro‐optic frequency combs: theory, characteristics, and applications
10.1002/lpor.202200353 · 2023 · External reference
Fast high-precision distance metrology using a pair of modulator-generated dual-color frequency combs
10.1364/oe.26.034305 · 2018 · External reference
Rapid and Precise Distance Measurement using Balanced Cross‐Correlation of a Single Frequency‐Modulated Electro‐Optic Comb
2025 · External reference
Noise-limited real-time orthogonal polarization spectral interferometry by suppressing phase noise
10.1117/1.apn.4.4.046002 · 2025 · External reference
Serrodyne‐Enabled dual Electro‐Optic Comb Interferometry for High‐Precision absolute Ranging and Integration‐Ready Metrology
10.1002/advs.71802 · 2025 · External reference
High-precision surface profilometry on a micron-groove based on dual-comb electronically controlled optical sampling
10.1364/ao.503753 · 2023 · External reference
High-precision 3D optical profilometry of non-cooperative targets by time-domain dual-comb coherent averaging
10.1063/5.0262787 · 2025 · External reference
Three-Dimensional Nano-displacement Measurement by Four-Beam Laser Interferometry
10.1007/s41871-024-00230-z · 2024 · External reference
Serrodyne‐Enabled dual Electro‐Optic Comb Interferometry for High‐Precision absolute Ranging and Integration‐Ready Metrology
10.1002/advs.71802 · ExternalCitation · doi-reference
Electro‐optic frequency combs: theory, characteristics, and applications
10.1002/lpor.202200353 · ExternalCitation · doi-reference
Three-Dimensional Nano-displacement Measurement by Four-Beam Laser Interferometry
10.1007/s41871-024-00230-z · ExternalCitation · doi-reference
On the Importance of Metrological Traceability in Nanomanufacturing
10.1007/s41871-025-00247-y · ExternalCitation · doi-reference
Dual-comb ranging
10.1016/j.eng.2018.10.002 · ExternalCitation · doi-reference
In-line through silicon vias etching depths inspection by spectroscopic reflectometry
10.1016/j.mee.2014.03.007 · ExternalCitation · doi-reference
An overview of through-silicon-via technology and manufacturing challenges
10.1016/j.mee.2014.10.019 · ExternalCitation · doi-reference
Rapid and precise absolute distance measurements at long range
10.1038/nphoton.2009.94 · ExternalCitation · doi-reference
Metrology for the next generation of semiconductor devices
10.1038/s41928-018-0150-9 · ExternalCitation · doi-reference
20 years of developments in optical frequency comb technology and applications
10.1038/s42005-019-0249-y · ExternalCitation · doi-reference
High-precision 3D optical profilometry of non-cooperative targets by time-domain dual-comb coherent averaging
10.1063/5.0262787 · ExternalCitation · doi-reference
Optical fiber-based confocal and interferometric system for measuring the depth and diameter of through silicon vias
10.1109/jlt.2016.2618419 · ExternalCitation · doi-reference
A Review of Through-Silicon Via Inspection and Metrology Technology for Advanced Semiconductor packaging
10.1115/1.4069965 · ExternalCitation · doi-reference
Noise-limited real-time orthogonal polarization spectral interferometry by suppressing phase noise
10.1117/1.apn.4.4.046002 · ExternalCitation · doi-reference
Machine learning–based 3D through-silicon via metrology for advanced packaging
10.1117/1.jmm.24.3.034003 · ExternalCitation · doi-reference
Optical frequency combs: Coherently uniting the electromagnetic spectrum
10.1126/science.aay3676 · ExternalCitation · doi-reference
High-precision surface profilometry on a micron-groove based on dual-comb electronically controlled optical sampling
10.1364/ao.503753 · ExternalCitation · doi-reference
Electromagnetic analysis for optical coherence tomography based through silicon vias metrology
10.1364/ao.58.007472 · ExternalCitation · doi-reference
Electro-optic frequency combs
10.1364/aop.382052 · ExternalCitation · doi-reference
Characterization of high density through silicon vias with spectral reflectometry
10.1364/oe.19.005993 · ExternalCitation · doi-reference
Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process
10.1364/oe.20.005011 · ExternalCitation · doi-reference
Fast high-precision distance metrology using a pair of modulator-generated dual-color frequency combs
10.1364/oe.26.034305 · ExternalCitation · doi-reference
Long-distance and high-precision ranging with dual-comb nonlinear asynchronous optical sampling
10.1364/oe.527583 · ExternalCitation · doi-reference
High-precision dual-comb ranging based on two-color nonlinear asynchronous optical sampling
10.1364/ol.575662 · ExternalCitation · doi-reference
A short review of through-silicon via (TSV) interconnects: metrology and analysis
10.3390/app13148301 · ExternalCitation · doi-reference
10.37188/lam.2025.074
10.37188/lam.2025.074 · ExternalCitation · doi-reference
3D measurement of TSVs using low numerical aperture white-light scanning interferometry
10.3807/josk.2013.17.4.317 · ExternalCitation · doi-reference
