Research graph
References from Enhanced microfluidic heat sinks with a bio-inspired metal skeleton toward thermal management of flexible electronics. Local targets link to admitted publications; unresolved targets remain external evidence.
Radiative Smart Fibers and Textiles: Thermal Management and Beyond
10.1021/acsnano.5c06463 · 2025 · External reference
Thermal management and control of wearable devices
10.1016/j.isci.2022.104587 · 2022 · External reference
A review of microfluidic technologies for thermal management in flexible electronics
10.1039/d5lc00906e · 2026 · External reference
Thermal performance of ultra-thin flat heat pipes with micro-channel wick
10.1016/j.applthermaleng.2025.127745 · 2025 · External reference
Thermal Management of Electronic Equipment: A Review of Technology and Research Topics
10.1115/1.3149515 · 1986 · External reference
Review of Heat Transfer Technologies in Electronic Equipment
10.1115/1.2792113 · 1995 · External reference
Emerging challenges and materials for thermal management of electronics
10.1016/j.mattod.2014.04.003 · 2014 · External reference
A critical review of traditional and emerging techniques and fluids for electronics cooling
10.1016/j.rser.2017.04.112 · 2017 · External reference
Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics
10.1016/j.applthermaleng.2022.119142 · 2022 · External reference
Non-Arrhenius Temperature Acceleration and Stress-Dependent Voltage Acceleration for Semiconductor Device Involving Multiple Failure Mechanisms
2006 · External reference
Numerical and experimental investigation of temperature dependence vs. mobility degradation on I–V characteristics in N-LDMOS structure
10.1016/j.csite.2024.104515 · 2024 · External reference
Passive thermal management of electronic devices
10.1016/j.device.2024.100684 · 2025 · External reference
2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications
10.1002/adma.202311335 · 2024 · External reference
Materials in Radiative Cooling Technologies
2025 · External reference
Thermoelectric Coolers: Progress, Challenges, and Opportunities
10.1002/smtd.202101235 · 2022 · External reference
Thermal and hydrodynamic analysis of microchannel heat sinks: A review
10.1016/j.rser.2013.01.022 · 2013 · External reference
A comprehensive review on microchannel heat sinks for electronics cooling
10.1088/2631-7990/ad12d4 · 2024 · External reference
Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A Review
10.1007/s11831-020-09495-1 · 2021 · External reference
A comprehensive analysis of a rectangular microchannel heat sink furnished with a circular perforated cylindrical pinfin
10.1080/10407782.2023.2219827 · 2023 · External reference
Lattice Boltzmann simulation of drop splitting in a fractal tree-like microchannel
10.1016/j.ces.2021.117277 · 2022 · External reference
Continuous production of bimetallic nanoparticles on carbon nanotubes based on 3D-printed microfluidics
10.1039/d3nr05090d · 2024 · External reference
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
10.1016/j.ijmecsci.2023.108228 · 2023 · External reference
A quantitative study on the influence of cavity distribution on flow and heat transfer characteristics in curved microchannels introducing the cavity throughput ratio
10.1016/j.applthermaleng.2024.122388 · 2024 · External reference
Numerical Investigation of Flow Patterns and Mixing Characteristics in a 3D Micromixer with Helical Elements over Wide Reynolds Numbers
2023 · External reference
PDMS nanocomposites for heat transfer enhancement in microfluidic platforms
10.1039/c4lc00615a · 2014 · External reference
Microfluidic heat sinks enhanced with a 2D metal framework for flexible thermal management
10.1016/j.applthermaleng.2026.132212 · 2026 · External reference
Flexible Polymer Foams in Thermal Management Technologies: Recent Advances and Applications
10.1002/pen.70049 · 2025 · External reference
A study of influence factors to improve the heat transfer of pure-polydimethylsiloxane (PDMS): A molecular dynamics study
10.1016/j.colsurfa.2021.126409 · 2021 · External reference
Rational construction of polyester/polydimethylsiloxane/boron nitride composite with enhanced thermal conductivity and mechanical properties
10.1002/pc.29685 · 2025 · External reference
Improved thermal conductivity for chemically functionalized exfoliated graphite/epoxy composites
10.1016/j.carbon.2008.02.008 · 2008 · External reference
Improved thermal conductivity of carbon-based thermal interface materials by high-magnetic-field alignment
10.1016/j.carbon.2018.08.029 · 2018 · External reference
ZnO nanowire-decorated Al2O3 hybrids for improving the thermal conductivity of polymer composites
10.1039/c9tc06805h · 2020 · External reference
Silver Nanoparticle-Enhanced Three-Dimensional Boron Nitride/Reduced Graphene Oxide Skeletons for Improving Thermal Conductivity of Polymer Composites
10.1021/acsapm.1c00210 · 2021 · External reference
High-Thermal-Conductivity Flexible Boron Nitride Composite Films Enabled by the Directional Arrangement of Nanosheet Assemblies
10.1021/acsami.5c25800 · 2026 · External reference
Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride
10.1126/science.aaz6149 · 2020 · External reference
Modulating the thermal conductivity in hexagonal boron nitride via controlled boron isotope concentration
10.1038/s42005-019-0145-5 · 2019 · External reference
Thermal transport property of boron nitride nanosheets
10.1063/5.0213741 · 2024 · External reference
The multifunctional composites based on new generation carbon microsphere and their hybrids with robust interfacial mechanical strength
2023 · External reference
Roll-to-Roll Continuous Manufacturing Multifunctional Nanocomposites by Electric-Field-Assisted “Z” Direction Alignment of Graphite Flakes in Poly(dimethylsiloxane)
10.1021/acsami.6b13207 · 2017 · External reference
Anisotropic Thermal Conductive Composite by the Guided Assembly of Boron Nitride Nanosheets for Flexible and Stretchable Electronics
2019 · External reference
Flexible, thermally conductive, electrically insulated, and high-temperature resistant PDMS@BN composite films with high orientation degree of BN sheets prepared by facile spin-coating
10.1002/app.55907 · 2024 · External reference
Preparation of h-BN microspheres for nanocomposites with high through-plane thermal conductivity
10.1111/jace.19219 · 2023 · External reference
Three-dimensional graphene foam/micro-diamond/PDMS composites with good thermal conductivity, electrical insulation and flexibility
2025 · External reference
Magnetically assisted polyvinyl alcohol composites with highly anisotropic thermal conductivity and recyclability for advanced thermal interface materials
10.1016/j.cej.2025.171670 · 2026 · External reference
Thermally conductive nanocomposite with silicon carbide nanowire-bridged boron nitride skeleton for multifunctional thermal interface materials
10.1016/j.compositesa.2025.108775 · 2025 · External reference
Graphite tube woven fabric/boron nitride/polymer composite with enhanced thermal conductivity and electric isolation
10.1002/pc.25168 · 2019 · External reference
Fabrication and electromagnetic interference shielding performance of open-cell foam of a Cu–Ni alloy integrated with CNTs
10.1016/j.apsusc.2014.05.067 · 2014 · External reference
Progress in polymers and polymer composites used as efficient materials for EMI shielding
10.1039/d0na00760a · 2021 · External reference
Curvature induced instability characteristics of laminar flow and heat transfer through a bent square channel
10.1016/j.cjph.2021.10.052 · 2022 · External reference
Two-dimensional fluid dynamics in a sharply bent channel: Laminar flow, separation bubble, and vortex dynamics
10.1063/1.4963864 · 2016 · External reference
Instability and transition in curved channel flow
10.1017/s0022112088003052 · 1988 · External reference
A low-cost and high-performance 3D micromixer over a wide working range and its application for high-sensitivity biomarker detection
10.1039/d2re00103a · 2022 · External reference
2D Materials-Based Thermal Interface Materials: Structure, Properties, and Applications
10.1002/adma.202311335 · ExternalCitation · doi-reference
Flexible, thermally conductive, electrically insulated, and high-temperature resistant PDMS@BN composite films with high orientation degree of BN sheets prepared by facile spin-coating
10.1002/app.55907 · ExternalCitation · doi-reference
Graphite tube woven fabric/boron nitride/polymer composite with enhanced thermal conductivity and electric isolation
10.1002/pc.25168 · ExternalCitation · doi-reference
Rational construction of polyester/polydimethylsiloxane/boron nitride composite with enhanced thermal conductivity and mechanical properties
10.1002/pc.29685 · ExternalCitation · doi-reference
Flexible Polymer Foams in Thermal Management Technologies: Recent Advances and Applications
10.1002/pen.70049 · ExternalCitation · doi-reference
Thermoelectric Coolers: Progress, Challenges, and Opportunities
10.1002/smtd.202101235 · ExternalCitation · doi-reference
Latest Advancements in Heat Transfer Enhancement in the Micro-channel Heat Sinks: A Review
10.1007/s11831-020-09495-1 · ExternalCitation · doi-reference
Microfluidic modular heat sink with improved material characteristics towards thermal management of flexible electronics
10.1016/j.applthermaleng.2022.119142 · ExternalCitation · doi-reference
A quantitative study on the influence of cavity distribution on flow and heat transfer characteristics in curved microchannels introducing the cavity throughput ratio
10.1016/j.applthermaleng.2024.122388 · ExternalCitation · doi-reference
Thermal performance of ultra-thin flat heat pipes with micro-channel wick
10.1016/j.applthermaleng.2025.127745 · ExternalCitation · doi-reference
Microfluidic heat sinks enhanced with a 2D metal framework for flexible thermal management
10.1016/j.applthermaleng.2026.132212 · ExternalCitation · doi-reference
Fabrication and electromagnetic interference shielding performance of open-cell foam of a Cu–Ni alloy integrated with CNTs
10.1016/j.apsusc.2014.05.067 · ExternalCitation · doi-reference
Improved thermal conductivity for chemically functionalized exfoliated graphite/epoxy composites
10.1016/j.carbon.2008.02.008 · ExternalCitation · doi-reference
Improved thermal conductivity of carbon-based thermal interface materials by high-magnetic-field alignment
10.1016/j.carbon.2018.08.029 · ExternalCitation · doi-reference
Magnetically assisted polyvinyl alcohol composites with highly anisotropic thermal conductivity and recyclability for advanced thermal interface materials
10.1016/j.cej.2025.171670 · ExternalCitation · doi-reference
Lattice Boltzmann simulation of drop splitting in a fractal tree-like microchannel
10.1016/j.ces.2021.117277 · ExternalCitation · doi-reference
Curvature induced instability characteristics of laminar flow and heat transfer through a bent square channel
10.1016/j.cjph.2021.10.052 · ExternalCitation · doi-reference
A study of influence factors to improve the heat transfer of pure-polydimethylsiloxane (PDMS): A molecular dynamics study
10.1016/j.colsurfa.2021.126409 · ExternalCitation · doi-reference
Thermally conductive nanocomposite with silicon carbide nanowire-bridged boron nitride skeleton for multifunctional thermal interface materials
10.1016/j.compositesa.2025.108775 · ExternalCitation · doi-reference
Numerical and experimental investigation of temperature dependence vs. mobility degradation on I–V characteristics in N-LDMOS structure
10.1016/j.csite.2024.104515 · ExternalCitation · doi-reference
Passive thermal management of electronic devices
10.1016/j.device.2024.100684 · ExternalCitation · doi-reference
An additively manufactured manifold-microchannel heat sink for high-heat flux cooling
10.1016/j.ijmecsci.2023.108228 · ExternalCitation · doi-reference
Thermal management and control of wearable devices
10.1016/j.isci.2022.104587 · ExternalCitation · doi-reference
Emerging challenges and materials for thermal management of electronics
10.1016/j.mattod.2014.04.003 · ExternalCitation · doi-reference
Thermal and hydrodynamic analysis of microchannel heat sinks: A review
10.1016/j.rser.2013.01.022 · ExternalCitation · doi-reference
A critical review of traditional and emerging techniques and fluids for electronics cooling
10.1016/j.rser.2017.04.112 · ExternalCitation · doi-reference
Instability and transition in curved channel flow
10.1017/s0022112088003052 · ExternalCitation · doi-reference
High-Thermal-Conductivity Flexible Boron Nitride Composite Films Enabled by the Directional Arrangement of Nanosheet Assemblies
10.1021/acsami.5c25800 · ExternalCitation · doi-reference
Roll-to-Roll Continuous Manufacturing Multifunctional Nanocomposites by Electric-Field-Assisted “Z” Direction Alignment of Graphite Flakes in Poly(dimethylsiloxane)
10.1021/acsami.6b13207 · ExternalCitation · doi-reference
Silver Nanoparticle-Enhanced Three-Dimensional Boron Nitride/Reduced Graphene Oxide Skeletons for Improving Thermal Conductivity of Polymer Composites
10.1021/acsapm.1c00210 · ExternalCitation · doi-reference
Radiative Smart Fibers and Textiles: Thermal Management and Beyond
10.1021/acsnano.5c06463 · ExternalCitation · doi-reference
Modulating the thermal conductivity in hexagonal boron nitride via controlled boron isotope concentration
10.1038/s42005-019-0145-5 · ExternalCitation · doi-reference
PDMS nanocomposites for heat transfer enhancement in microfluidic platforms
10.1039/c4lc00615a · ExternalCitation · doi-reference
ZnO nanowire-decorated Al2O3 hybrids for improving the thermal conductivity of polymer composites
10.1039/c9tc06805h · ExternalCitation · doi-reference
Progress in polymers and polymer composites used as efficient materials for EMI shielding
10.1039/d0na00760a · ExternalCitation · doi-reference
A low-cost and high-performance 3D micromixer over a wide working range and its application for high-sensitivity biomarker detection
10.1039/d2re00103a · ExternalCitation · doi-reference
Continuous production of bimetallic nanoparticles on carbon nanotubes based on 3D-printed microfluidics
10.1039/d3nr05090d · ExternalCitation · doi-reference
A review of microfluidic technologies for thermal management in flexible electronics
10.1039/d5lc00906e · ExternalCitation · doi-reference
Two-dimensional fluid dynamics in a sharply bent channel: Laminar flow, separation bubble, and vortex dynamics
10.1063/1.4963864 · ExternalCitation · doi-reference
Thermal transport property of boron nitride nanosheets
10.1063/5.0213741 · ExternalCitation · doi-reference
A comprehensive analysis of a rectangular microchannel heat sink furnished with a circular perforated cylindrical pinfin
10.1080/10407782.2023.2219827 · ExternalCitation · doi-reference
A comprehensive review on microchannel heat sinks for electronics cooling
10.1088/2631-7990/ad12d4 · ExternalCitation · doi-reference
Preparation of h-BN microspheres for nanocomposites with high through-plane thermal conductivity
10.1111/jace.19219 · ExternalCitation · doi-reference
Review of Heat Transfer Technologies in Electronic Equipment
10.1115/1.2792113 · ExternalCitation · doi-reference
Thermal Management of Electronic Equipment: A Review of Technology and Research Topics
10.1115/1.3149515 · ExternalCitation · doi-reference
Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride
10.1126/science.aaz6149 · ExternalCitation · doi-reference
