References

Cooling electronic equipment past present and future

1990 · External reference

Boiling heat transfer characteristics of simulated microelectronic chips with detechable heat sinks

1998 · External reference

Effects of size of simulated microelectronic chips on boiling and critical heat flux

10.1115/1.3250552 · 1988 · External reference

A method to reduce temperature overshoots in immersion cooling of electronic devices

1988 · External reference

The influence of subcooling on the pool nucleate boiling and critical heat flux of simulated electronic chips

1990 · External reference

Boiling heat transfer characteristics of simulated microelectronic chips with fluorinert liquids

1990 · External reference

Direct liquid cooling of microelectronic components

1990 · External reference

Boiling jet impingement cooling of simulated microelectrnic chips

1983 · External reference

Effects of thermal properties and thickness of horizontal vertically oriented ribbon heaters on the pool boiling critical heat flux

1992 · External reference

Immersion cooling of a multichip module by pool boiling of FC-86

1993 · External reference

Liquid immersion cooling of electronic components

1990 · External reference

Thermal management of electronic components with dielectric liquids

10.1299/jsmeb.36.1 · 1993 · External reference

Jet impingement flow boiling of a mixture of FC-72 and FC-87 liquids on a simulated electronic chip

1989 · External reference

Heat transfer from chips to dielectric coolant: enhanced pool boiling versus jet impingement cooling

10.1615/jenhheattransf.v1.i3.50 · 1994 · External reference

Single-phase and boiling cooling of a small heat source by multiple nozzle jet impingement

1998 · External reference

Liquid jet impingement heat transfer with or without boiling

10.1007/bf02650835 · 1993 · External reference

Local jet impingement boiling heat transfer

10.1016/0017-9310(95)00216-2 · 1996 · External reference

A computational study of two-phase jet impingement cooling of an electronic chip

1999 · External reference

Unresolved reference

1994 · External reference

Cooling of electronics by heat pipes and thermosyphons – a review of methods and possibilities

1996 · External reference

Local heat transfer coefficients under an axisymmetric single-phase liquid jet

1989 · External reference

Single-phase liquid jet impingement cooling of small heat sources

1990 · External reference

Correlating equations for impingement cooling of small heat sources with single circular liquid jets

10.1115/1.2910635 · 1993 · External reference

Correlating equations for impingement cooling of small heat sources with multiple circular liquid jets

10.1115/1.2911423 · 1994 · External reference

Thermofluid design of single-phase submerged-jet impingement cooling for electronic components

10.1115/1.2905692 · 1994 · External reference

Heat and mass transfer between impinging gas jets and solid surfaces

10.1016/s0065-2717(08)70221-1 · 1977 · External reference

Cooling of a multichip electronic module by means of confined two-dimensional jets of dielectric liquid

10.1115/1.2910496 · 1990 · External reference

Convective heat transfer enhancement due to intermittency in an impinging jet

10.1115/1.2910675 · 1993 · External reference

Liquid jet impingement heat transfer on a uniform flux surface

1989 · External reference

Convective heat transfer by impingement of circular liquid jets

10.1115/1.2910604 · 1991 · External reference

Stagnation point heat transfer during impingement of laminar liquid jets: analysis with surface tension effects

1992 · External reference

Numerical simulation of laminar convection heat transfer from an in-line array of discrete sources to a confined rectangular jet

10.1080/10407789208944762 · 1992 · External reference

Numerical modeling of conjugate heat transfer during free liquid jet impingement

1998 · External reference

Conjugate heat transfer between a laminar impinging liquid jet and a solid disk

10.1016/0017-9310(89)90125-7 · 1989 · External reference

Visualization of flow phenomena near enhanced surfaces

10.1115/1.2910883 · 1994 · External reference

A comparison of augmentation techniques during in-tube evaporation of R-113

10.1115/1.2910582 · 1991 · External reference

Unresolved reference

1990 · External reference

Unresolved reference

1994 · External reference

Dynamic model of enhancement boiling heat transfer on porous surfaces, Part I: experimental investigation

10.1115/1.3244320 · 1980 · External reference

Unresolved reference

External reference

Unresolved reference

External reference

An integral heat sink for cooling microelectronic components

10.1115/1.2909330 · 1993 · External reference

Use of smooth and roughened spreader plates to enhance impingement cooling of small heat sources with single circular jets

1992 · External reference

Jet impingement cooling of an array of discrete heat sources with extended surfaces

1993 · External reference

Enhancement of single-phase heat transfer and critical heat flux from an ultra-high-flux simulated microelectronic heat source to a rectangular impinging jet of dielectric liquid

10.1115/1.2911348 · 1992 · External reference

Impact spray boiling for thermal control of electronic systems

1989 · External reference

Comparison of two-phase electronic cooling using free jets and sprays, Advances in electronic packaging

1995 · External reference

Laminated high-aspect-ratio microstructures in a conventional CMOS process

10.1016/s0924-4247(97)80100-8 · 1997 · External reference

Unresolved reference

External reference

Thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

2000 · External reference

Break-up of liquid jets from irregular shaped silicon micro nozzles

2001 · External reference

Fabrication of silicon sidewall profiles for fluidic applications using modified advanced silicon etching

2001 · External reference

Transient thermal design of wearable computers with embedded electronics using phase change materials

1997 · External reference

Transient thermal management of temperature fluctuations during time varying workloads on portable electronics

10.1109/6144.814970 · 1999 · External reference

Performance analysis of an enhanced PCM thermal control unit

2000 · External reference

Bayesian surrogates for integrating numerical, analytical and experimental data: application to inverse heat transfer in wearable computers

2000 · External reference

A spectral element method for fluid dynamics: Laminar flow in a channel expansion

10.1016/0021-9991(84)90128-1 · 1984 · External reference

Spectral element – Fourier method for transitional flows in complex geometries

10.2514/3.49002 · 1993 · External reference

Spectral element – Fourier method for unsteady conjugate heat transfer in complex geometry flows

10.2514/3.653 · 1995 · External reference

Dielec-tric jet impingement cooling of electronic chips

2000 · External reference

Effect of material composition and localized heat generation on time-dependent conjugate heat transport

10.1016/0017-9310(94)00292-4 · 1995 · External reference