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References from Lead-free Solders in Microelectronics. Local targets link to admitted publications; unresolved targets remain external evidence.
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In search of new lead-free electronic solders
10.1007/bf02651363 · 1994 · External reference
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10.1109/iemt.1995.526121
10.1109/iemt.1995.526121 · External reference
An assessment of the use of lead in electronics assembly
1993 · External reference
10.1038/333134a0
10.1038/333134a0 · External reference
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Foreword
1994 · External reference
10.1109/iemt.1995.526121
10.1109/iemt.1995.526121 · External reference
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Microstructure and mechanical properties of Pb-free solder alloys for low cost electronic assembly: a review
10.1007/bf02651361 · 1994 · External reference
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Metals demand in telecommunication
1986 · External reference
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10.1109/iemt.1995.526121
10.1109/iemt.1995.526121 · External reference
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Metallurgy of low temperature Pb-free solders for electronic assembly
10.1179/imr.1995.40.2.65 · 1995 · External reference
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Improved mechanical properties in new, Pb-free solder alloys
10.1007/bf02651364 · 1994 · External reference
10.1007/bf03222376
10.1007/bf03222376 · External reference
Phase relationships in Bi–In–Sn alloy systems
10.1179/mst.1986.2.10.985 · 1986 · External reference
The characterization of eutectic structure
10.1098/rspa.1973.0111 · 1973 · External reference
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New Pb-free solder alloy with superior mechanical properties
10.1063/1.109734 · 1993 · External reference
10.1109/isee.1995.514970
10.1109/isee.1995.514970 · External reference
Superplastic creep of low melting point solder joints
10.1007/bf02660403 · 1992 · External reference
Microstructure and creep of indium/tin on Cu and Ni substrates
10.1007/bf02655434 · 1992 · External reference
10.1108/eb037812
10.1108/eb037812 · External reference
Metallurgy of low temperature Pb-free solders for electronic assembly
10.1179/imr.1995.40.2.65 · 1995 · External reference
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Wave soldering with a low melting point Bi–Sn alloy: effects of soldering temperatures and circuit board finishes
10.1007/bf02659914 · 1996 · External reference
Investigation of multi-component lead-free solders
10.1007/bf02651368 · 1994 · External reference
A study of lead-free solder alloys
1995 · External reference
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A novel lead-free solder replacement
1995 · External reference
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Progress in the design of new lead-free solder alloys
10.1007/bf03222379 · 1993 · External reference
A viable tin–lead solder substitute: Sn–Ag–Cu
10.1007/bf02653344 · 1994 · External reference
A comparison of lead-free vs. eutectic solders
1995 · External reference
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New lead-free, Sn–Zn–In solder alloys
10.1007/bf02653357 · 1994 · External reference
10.1149/1.2428700
10.1149/1.2428700 · External reference
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Measurement of solder-flux-vapor surface tension by a modified maximum bubble pressure technique
10.1063/1.1134615 · 1976 · External reference
Surface tension of solder alloys
1982 · External reference
10.1179/mst.1987.3.12.1040
10.1179/mst.1987.3.12.1040 · External reference
Alternative solders for electronics assemblies
10.1108/eb046210 · 1993 · External reference
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10.1109/iemt.1992.639908
10.1109/iemt.1992.639908 · External reference
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Issues in the replacement of lead-bearing solders
10.1007/bf03222374 · 1993 · External reference
Evaluation of lead-free joints in electronic assemblies
10.1007/bf02651370 · 1994 · External reference
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Lead-free solder joint evaluation
1998 · External reference
Interdiffusion and reaction in bimetallic Cu–Sn thin films
10.1016/s0254-0584(97)80016-8 · 1996 · External reference
Effects of Fe, Ni, and Sn on reaction diffusion at solder/Cu base alloy interface
10.2320/jinstmet1952.48.9_863 · 1984 · External reference
10.1080/00202967.1976.11870376
10.1080/00202967.1976.11870376 · External reference
Dependence of Cu/Sn and Cu/60Sn40Pb solder joint strength on diffusion controlled growth of Cu3Sn and Cu6Sn5
10.1557/proc-40-129 · 1985 · External reference
10.1149/1.2428700
10.1149/1.2428700 · External reference
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The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin–bismuth solder
10.1007/bf01132413 · 1987 · External reference
10.1007/978-94-011-6050-6
10.1007/978-94-011-6050-6 · External reference
The mechanical behavior of interconnect materials for electronic packaging
1996 · External reference
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Constitutive relations for tin-based solder joints, IEEE transactions on components
1992 · External reference
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1987 · External reference
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10.1109/iemt.1995.526123
10.1109/iemt.1995.526123 · External reference
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10.1109/3476.681391
10.1109/3476.681391 · External reference
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The trek towards lead-free solders
1996 · External reference
Lead-free assembly of mixed-technology PCB’s
1997 · External reference
