Research graph
References from Tin–lead (SnPb) solder reaction in flip chip technology. Local targets link to admitted publications; unresolved targets remain external evidence.
Unresolved reference
External reference
Solid logic technology: versatile, high performance microelectronics
10.1147/rd.441.0056 · 2000 · External reference
Controlled collapse reflow chip joining
10.1147/rd.133.0239 · 1969 · External reference
SLT device metallurgy and its monolithic extensions
10.1147/rd.133.0226 · 1969 · External reference
10.1007/978-1-4615-1389-6
10.1007/978-1-4615-1389-6 · External reference
Unresolved reference
External reference
Unresolved reference
External reference
Thin film reactions of Pb with AgAu and AgPd alloys
10.1063/1.322047 · 1975 · External reference
10.1109/tchmt.1982.1136012
10.1109/tchmt.1982.1136012 · External reference
Kinetics of thin film reactions between Pb and AgPd alloys
10.1063/1.324182 · 1977 · External reference
Unresolved reference
External reference
Microstructure of phase-in Cr–Cu/Cu/Au bump-limiting-metallization and its soldering behavior with high Pb and eutectic SnPb solders
10.1063/1.120224 · 1997 · External reference
Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
10.1063/1.113975 · 1995 · External reference
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
10.1103/physrevb.53.16027 · 1996 · External reference
Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
10.1063/1.363728 · 1996 · External reference
Ripening-assisted asymmetric spalling of Cu–Sn compound spheroids in solder joints on Si wafers
10.1063/1.116013 · 1996 · External reference
Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film
10.1557/jmr.1998.0152 · 1998 · External reference
Metastable structures in metallurgy
10.1007/bf02648333 · 1981 · External reference
Metastable phase formation in thin film reactions
10.1016/0921-5093(91)90965-p · 1991 · External reference
Studies of SLT chip terminal metallurgy
10.1147/rd.133.0286 · 1969 · External reference
Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
10.1063/1.369779 · 1999 · External reference
Interfacial morphology and shear deformation of flip chip solder joints
10.1557/jmr.2000.0242 · 2000 · External reference
Microstructure–electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
10.1063/1.124276 · 1999 · External reference
Unresolved reference
External reference
Interface diffusion in eutectic Pb–Sn solder
10.1016/s1359-6454(98)00348-6 · 1999 · External reference
Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions
10.1007/s11664-998-0068-5 · 1998 · External reference
The growth of Cu–Sn intermetallics at a pretinned copper/solder interface
10.1007/bf02665064 · 1992 · External reference
The formation of Cu3Sn intermetallic on the reaction of copper with 95Pb5Sn solder
10.1007/bf02661885 · 1986 · External reference
Unresolved reference
External reference
Algebraic representation of thermodynamic properties and the classification of solutions
10.1021/ie50458a036 · 1948 · External reference
10.1007/978-1-4684-1440-0_4
10.1007/978-1-4684-1440-0_4 · External reference
Thermodynamic study of phase equilibria in the Pb–Sn–Sb system
10.1007/bf02645349 · 1995 · External reference
Thermodynamic assessment of the Cu–Sn system
1996 · External reference
Unresolved reference
External reference
Unresolved reference
External reference
Unresolved reference
External reference
Thermodynamic considerations in the analysis of phase stability: the role of interfacial equilibrium in the determination of phase diagrams by X-ray microanalytical techniques
10.1007/bf02869262 · 1987 · External reference
Second phase dissolution
10.1007/bf02663326 · 1971 · External reference
Unresolved reference
External reference
Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
10.1007/s11664-001-0212-y · 2001 · External reference
The rule of Cu–Sn intermetallics in wettability degradation
10.1007/bf02655460 · 1995 · External reference
Effect of solid state intermetallic growth on the fracture toughness of Cu/63Sn–37Pb solder joints
1996 · External reference
10.1557/proc-19-403
10.1557/proc-19-403 · External reference
Growth kinetics of planar binary diffusion couples: thin film case versus bulk cases
10.1063/1.331028 · 1982 · External reference
Some aspects of the growth of diffusion layers in binary systems
10.1016/0022-3115(61)90175-1 · 1961 · External reference
A theory of multiphase binary diffusion
10.1016/0001-6160(76)90023-7 · 1976 · External reference
Analysis of thin film structures with nuclear backscattering and X-ray diffraction
10.1116/1.1318668 · 1974 · External reference
Structure and growth kinetics of Ni2Si on silicon
10.1016/0040-6090(75)90058-9 · 1975 · External reference
Thermal and ion-induced dissociation of NiSi and NiSi2 in contact with nickel
10.1016/0040-6090(83)90033-0 · 1983 · External reference
First phase nucleation in silicon–transition metal planar interface
10.1063/1.88590 · 1976 · External reference
10.1557/proc-25-15
10.1557/proc-25-15 · External reference
Formation of an amorphous alloy by solid state reaction of the pure polycrystalline metals
10.1103/physrevlett.51.415 · 1983 · External reference
Formation of an amorphous RhSi alloy by interfacial reaction between amorphous Si and crystalline Rh thin films
10.1063/1.94014 · 1983 · External reference
Solid phase amorphization and crystallization in multilayer and bilayer RhSi thin films
10.1016/0254-0584(93)90047-p · 1993 · External reference
Transmission electron microscopic observations of amorphous NiZr alloy formation by solid state reaction
10.1063/1.96881 · 1986 · External reference
Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils
10.1063/1.371751 · 1999 · External reference
Wetting reaction vs. solid state aging of eutectic SnPb on Cu
10.1063/1.1357469 · 2000 · External reference
A study of solute diffusion in liquid tin
10.1016/0001-6160(60)90008-0 · 1960 · External reference
Unresolved reference
External reference
Flow of simple liquids down narrow V grooves
10.1103/physreve.52.3967 · 1995 · External reference
Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film
10.1103/physreve.58.6308 · 1998 · External reference
Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
10.1557/jmr.1995.0497 · 1995 · External reference
Rapid soldering reactions of eutectic SnPb and eutectic SnBi on palladium surfaces
10.1016/0956-716x(95)00095-d · 1995 · External reference
Fast dissolution and soldering reactions on Au foils
10.1016/s0254-0584(97)02076-2 · 1998 · External reference
Thermodynamic modeling of the Ni–Pb–Sn system
10.1007/s11661-999-0085-x · 1999 · External reference
10.1557/proc-40-123
10.1557/proc-40-123 · External reference
Unresolved reference
External reference
The interaction kinetics and compound formation between electroless Ni–P and solder
10.1016/0040-6090(94)90761-7 · 1994 · External reference
Unresolved reference
External reference
Preparation of solder bumps incorporating electroless nickel–boron deposit and investigation on the interfacial interaction behavior and wetting kinetics
10.1023/a:1018599609177 · 1997 · External reference
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
10.1063/1.370627 · 1999 · External reference
Kinetics of interfacial reaction between eutectic SnPb solder and Cu/Ni/Pd metallizations
10.1007/s11664-999-0163-2 · 1999 · External reference
Unresolved reference
External reference
Dissolution of Au, Ag, Pd, Pt, Cu, and Ni in a molten tin–lead solder
1969 · External reference
Solder bump formation using electroless plating and ultrasonic soldering
10.1109/33.52858 · 1990 · External reference
Unresolved reference
External reference
Intermetallic compound growth in tin and tin–lead platings over nickel and its effects on solderability
1989 · External reference
Growth of intermetallic compounds on common basis material coated with tin or tin–lead alloys
10.1080/00202967.1976.11870376 · 1976 · External reference
Morphology of interfacial reaction between Pb-free solders and electroless Ni(P) under-bump-metallization
10.1063/1.1321787 · 2000 · External reference
Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation
10.1063/1.370880 · 1999 · External reference
Ultrafast intermetallic compound formation between eutectic SnPb and Pd where the intermetallic is not a diffusion barrier
10.1063/1.114467 · 1995 · External reference
Unresolved reference
External reference
Diffusion and phase transformations during interfacial reaction between lead–tin solders and palladium
10.1007/s11664-998-0064-9 · 1998 · External reference
Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between SnPb solder and Cu/Ni/Pd metallization
10.1016/s1359-6454(00)00165-8 · 2000 · External reference
Thermodynamic modeling of the Pd–Pb–Sn system
10.1007/s11661-999-0191-9 · 1999 · External reference
Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe
10.1063/1.120434 · 1997 · External reference
Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films
10.1063/1.368136 · 1998 · External reference
Unresolved reference
External reference
The Au–Pb–Sn ternary system
10.1016/0022-5088(67)90094-x · 1967 · External reference
Morphology of wetting reaction of eutectic SnPb solder on Au foils
10.1063/1.363336 · 1996 · External reference
Constitution of Au–AuSn–Pb partial ternary system
10.1179/mst.1987.3.8.621 · 1987 · External reference
Diffusion controlled reactions in Au/Pb–Sn solder system
10.1179/mst.1992.8.9.817 · 1992 · External reference
Reaction kinetics of solder balls with pads in BGA packages during reflow soldering
10.1007/s11664-999-0162-3 · 1999 · External reference
Constitution of AuSn–Pb–Sn partial ternary system
10.1179/mst.1985.1.6.433 · 1985 · External reference
Unresolved reference
External reference
Unresolved reference
External reference
Unresolved reference
External reference
10.1109/iemt.1999.804790
10.1109/iemt.1999.804790 · External reference
10.1109/iemt.1999.804791
10.1109/iemt.1999.804791 · External reference
Formation and resettlement of (AuxSn1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
10.1007/s11664-000-0010-y · 2000 · External reference
Growth of a Au–Ni–Sn intermetallic compound on the solder–substrate interface after aging
10.1007/s11661-000-0022-5 · 2000 · External reference
Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb–Sn solder joints reflowed on Au/Ni metallization
10.1007/s11664-000-0009-4 · 2000 · External reference
10.1109/ectc.1999.776214
10.1109/ectc.1999.776214 · External reference
10.1109/iemte.1998.723081
10.1109/iemte.1998.723081 · External reference
Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition
10.1557/jmr.1998.0006 · 1998 · External reference
Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
10.1063/1.371967 · 2000 · External reference
Development of under bump metallizations for flip chip bonding to organic substrates
10.1007/s11664-999-0149-0 · 1999 · External reference
Single intermetallic compound formation in PdPb and PdSn thin-film couples studied by X-ray diffraction
10.1016/0167-577x(82)90029-5 · 1982 · External reference
10.7567/jjaps.2s1.633
10.7567/jjaps.2s1.633 · External reference
