References

Some calculations of temperature profiles in thin films with laser heating

10.1007/bf00616563 · 1987 · External reference

Unresolved reference

1986 · External reference

Laser induced thermal profiles in thermally and optically thin films

10.1007/bf00696211 · 1988 · External reference

Low temperature direct silicon wafer bonding using argon activation

10.1143/jjap.36.l527 · 1997 · External reference

Low temperature Si3N4 direct bonding

10.1063/1.109002 · 1993 · External reference

Temperature distributions produced in a two layer structure by a scanning CW laser or electron beam

10.1063/1.331216 · 1982 · External reference

Thermally induced optical nonlinearity during transient heating of thin films

10.1115/1.2911401 · 1994 · External reference

Excimer laser-induced temperature field in melting and resolidification of silicon thin films

10.1063/1.371823 · 2000 · External reference

Vacuum packaging for microsensors by glass-silicon anodic bonding

10.1016/0924-4247(94)80003-0 · 1994 · External reference

Unresolved reference

1999 · External reference

Optical absorption coefficient of silicon at 1.152 μ at elevated temperatures

10.1063/1.93621 · 1982 · External reference

The application of nanosecond-pulsed laser welding technology in MEMS packaging with a shadow mask

10.1016/s0924-4247(01)00849-4 · 2002 · External reference

Local laser bonding for low temperature budget

10.1016/s0924-4247(01)00871-8 · 2002 · External reference

Selection of glass, anodic bonding conditions and material compatibility for silicon-glass capacitive sensors

10.1016/0924-4247(94)00872-f · 1995 · External reference

Unresolved reference

1991 · External reference

Locally selective bonding of silicon and glass with laser

10.1016/s0924-4247(01)00622-7 · 2001 · External reference

Nanosecond-time-resolution thermal emission measurement during pulsed excimer-laser interaction with materials

10.1007/bf01568087 · 1996 · External reference