Research graph
References from Research on the Patterning Polyimide Layer Based on Laser Ablation Technology. Local targets link to admitted publications; unresolved targets remain external evidence.
10.1109/eptc62800.2024.10909886
10.1109/eptc62800.2024.10909886 · External reference
10.1109/ectc32696.2021.00070
10.1109/ectc32696.2021.00070 · External reference
Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging
10.1002/admt.202401848 · 2025 · External reference
Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO2 and Silicon-EMC) Found in Microchips
10.3390/polym17040520 · 2025 · External reference
10.1109/icept67137.2025.11157007
10.1109/icept67137.2025.11157007 · External reference
Development of hybrid bonding using area-selective passivation layer deposition technology on various substrates for heterogeneous integrated structure
10.35848/1347-4065/ad9481 · 2024 · External reference
10.1109/eptc56328.2022.10013232
10.1109/eptc56328.2022.10013232 · External reference
10.1109/impact63555.2024.10818933
10.1109/impact63555.2024.10818933 · External reference
10.23919/icep51988.2021.9451938
10.23919/icep51988.2021.9451938 · External reference
10.1109/icept52650.2021.9568122
10.1109/icept52650.2021.9568122 · External reference
UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips
10.1016/j.mee.2023.112014 · 2023 · External reference
10.1109/ectc51529.2024.00097
10.1109/ectc51529.2024.00097 · External reference
10.1109/impact53160.2021.9696968
10.1109/impact53160.2021.9696968 · External reference
Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
10.1109/jeds.2024.3358830 · 2024 · External reference
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
10.1021/acsapm.5c00001 · 2025 · External reference
Panel level IC-package technology development
10.1016/j.microrel.2022.114657 · 2022 · External reference
The application of organic materials used in IC advanced packaging: A review
10.1016/j.memori.2025.100124 · 2025 · External reference
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
10.1021/acsapm.2c01415 · 2022 · External reference
10.1109/eurosime56861.2023.10100807
10.1109/eurosime56861.2023.10100807 · External reference
An Introduction on the IC Packaging Technology of FOPLP
10.33079/jomm.25051001 · 2025 · External reference
336 Gbps silicon photodetector with a low-loss fan-out wafer-level heterogeneous redistribution layer
10.1117/1.apn.5.3.036017 · 2026 · External reference
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
10.3389/felec.2024.1515860 · 2026 · External reference
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration
10.3390/mi13071147 · 2022 · External reference
Surface effects and adhesion of polysilazane and polyimide film bonding to copper redistribution layer with oxygen plasma treatment for advanced semiconductor packaging
10.1016/j.surfin.2025.106158 · 2025 · External reference
Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components
10.3390/polym16040463 · 2024 · External reference
10.1109/edm61683.2024.10615019
10.1109/edm61683.2024.10615019 · External reference
Laser Lift-Off Technologies for Ultra-Thin Emerging Electronics: Mechanisms, Applications, and Progress
10.1002/admt.202201186 · 2023 · External reference
10.1109/ipfa55383.2022.9915784
10.1109/ipfa55383.2022.9915784 · External reference
10.23919/icep61562.2024.10535597
10.23919/icep61562.2024.10535597 · External reference
A low-damage copper removal process by femtosecond laser for integrated circuits
10.1016/j.vacuum.2022.111273 · 2022 · External reference
10.1109/eptc59621.2023.10457733
10.1109/eptc59621.2023.10457733 · External reference
Domain-limiting effect modulation of laser debonding threshold based on wafer stacking structure for advanced packaging
10.1016/j.apsusc.2024.162219 · 2025 · External reference
A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers
10.1109/tcpmt.2023.3265568 · 2023 · External reference
The Influence of Laser Processing Modes on the Process of Gas Formation in Polyimide Film
10.1134/s2075113326700073 · 2026 · External reference
Lab to Fab Process Using Ablation Lasers: A Lightweight, Flexible, and Biocompatible Microheater for Wearable Therapy Applications
10.1021/acsabm.5c01263 · 2025 · External reference
Femtosecond Laser Ablation of Porous PVDF and PES Membranes: Ablation Behaviors and In-Plane Cross-Sectioning
10.1002/pol.20250427 · 2025 · External reference
Luminescent carbon dots structure by charcoal laser ablation in biocompatible liquid
10.1080/1536383x.2025.2461504 · 2025 · External reference
Pump-Probe Detection of Diamond Ionization and Ablation Induced by Ultra-Fast Laser
10.3390/photonics12030280 · 2025 · External reference
Ultrafast charge emission at terahertz frequency in high-intensity femtosecond laser ablation process
10.1063/5.0325476 · 2026 · External reference
Study on the mechanism of 355 nm laser ablation of hard bone tissue mediated by annular water mist
10.2351/7.0002086 · 2026 · External reference
Laser Lift-Off Technologies for Ultra-Thin Emerging Electronics: Mechanisms, Applications, and Progress
10.1002/admt.202201186 · ExternalCitation · doi-reference
Advanced Optical Integration Processes for Photonic-Integrated Circuit Packaging
10.1002/admt.202401848 · ExternalCitation · doi-reference
Femtosecond Laser Ablation of Porous PVDF and PES Membranes: Ablation Behaviors and In-Plane Cross-Sectioning
10.1002/pol.20250427 · ExternalCitation · doi-reference
Domain-limiting effect modulation of laser debonding threshold based on wafer stacking structure for advanced packaging
10.1016/j.apsusc.2024.162219 · ExternalCitation · doi-reference
UV-curable polyimide/layered silicate films with improved barrier properties for the protection of semiconductor chips
10.1016/j.mee.2023.112014 · ExternalCitation · doi-reference
The application of organic materials used in IC advanced packaging: A review
10.1016/j.memori.2025.100124 · ExternalCitation · doi-reference
Panel level IC-package technology development
10.1016/j.microrel.2022.114657 · ExternalCitation · doi-reference
Surface effects and adhesion of polysilazane and polyimide film bonding to copper redistribution layer with oxygen plasma treatment for advanced semiconductor packaging
10.1016/j.surfin.2025.106158 · ExternalCitation · doi-reference
A low-damage copper removal process by femtosecond laser for integrated circuits
10.1016/j.vacuum.2022.111273 · ExternalCitation · doi-reference
Lab to Fab Process Using Ablation Lasers: A Lightweight, Flexible, and Biocompatible Microheater for Wearable Therapy Applications
10.1021/acsabm.5c01263 · ExternalCitation · doi-reference
Controlled Thermal Imidization of Thermoplastic Polyimide for Temporary Bonding and Debonding in Advanced Packages
10.1021/acsapm.2c01415 · ExternalCitation · doi-reference
Low-CTE, Strong-Adhesion, and High-Resolution Photosensitive Polyimide Materials for Advanced Packaging Applications: Structure and Properties
10.1021/acsapm.5c00001 · ExternalCitation · doi-reference
Ultrafast charge emission at terahertz frequency in high-intensity femtosecond laser ablation process
10.1063/5.0325476 · ExternalCitation · doi-reference
Luminescent carbon dots structure by charcoal laser ablation in biocompatible liquid
10.1080/1536383x.2025.2461504 · ExternalCitation · doi-reference
10.1109/ectc32696.2021.00070
10.1109/ectc32696.2021.00070 · ExternalCitation · doi-reference
10.1109/ectc51529.2024.00097
10.1109/ectc51529.2024.00097 · ExternalCitation · doi-reference
10.1109/edm61683.2024.10615019
10.1109/edm61683.2024.10615019 · ExternalCitation · doi-reference
10.1109/eptc56328.2022.10013232
10.1109/eptc56328.2022.10013232 · ExternalCitation · doi-reference
10.1109/eptc59621.2023.10457733
10.1109/eptc59621.2023.10457733 · ExternalCitation · doi-reference
10.1109/eptc62800.2024.10909886
10.1109/eptc62800.2024.10909886 · ExternalCitation · doi-reference
10.1109/eurosime56861.2023.10100807
10.1109/eurosime56861.2023.10100807 · ExternalCitation · doi-reference
10.1109/icept52650.2021.9568122
10.1109/icept52650.2021.9568122 · ExternalCitation · doi-reference
10.1109/icept67137.2025.11157007
10.1109/icept67137.2025.11157007 · ExternalCitation · doi-reference
10.1109/impact53160.2021.9696968
10.1109/impact53160.2021.9696968 · ExternalCitation · doi-reference
10.1109/impact63555.2024.10818933
10.1109/impact63555.2024.10818933 · ExternalCitation · doi-reference
10.1109/ipfa55383.2022.9915784
10.1109/ipfa55383.2022.9915784 · ExternalCitation · doi-reference
Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
10.1109/jeds.2024.3358830 · ExternalCitation · doi-reference
A Critical Review of Lithography Methodologies and Impacts of Topography on 2.5-D/3-D Interposers
10.1109/tcpmt.2023.3265568 · ExternalCitation · doi-reference
336 Gbps silicon photodetector with a low-loss fan-out wafer-level heterogeneous redistribution layer
10.1117/1.apn.5.3.036017 · ExternalCitation · doi-reference
The Influence of Laser Processing Modes on the Process of Gas Formation in Polyimide Film
10.1134/s2075113326700073 · ExternalCitation · doi-reference
Study on the mechanism of 355 nm laser ablation of hard bone tissue mediated by annular water mist
10.2351/7.0002086 · ExternalCitation · doi-reference
10.23919/icep51988.2021.9451938
10.23919/icep51988.2021.9451938 · ExternalCitation · doi-reference
10.23919/icep61562.2024.10535597
10.23919/icep61562.2024.10535597 · ExternalCitation · doi-reference
An Introduction on the IC Packaging Technology of FOPLP
10.33079/jomm.25051001 · ExternalCitation · doi-reference
Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
10.3389/felec.2024.1515860 · ExternalCitation · doi-reference
Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration
10.3390/mi13071147 · ExternalCitation · doi-reference
Pump-Probe Detection of Diamond Ionization and Ablation Induced by Ultra-Fast Laser
10.3390/photonics12030280 · ExternalCitation · doi-reference
Mode I Fatigue and Fracture Assessment of Polyimide-Epoxy and Silicon-Epoxy Interfaces in Chip-Package Components
10.3390/polym16040463 · ExternalCitation · doi-reference
Impact of Thermal Variations on the Fatigue and Fracture of Bi-Material Interfaces (Polyimide-EMC, Polyimide-SiO2 and Silicon-EMC) Found in Microchips
10.3390/polym17040520 · ExternalCitation · doi-reference
Development of hybrid bonding using area-selective passivation layer deposition technology on various substrates for heterogeneous integrated structure
10.35848/1347-4065/ad9481 · ExternalCitation · doi-reference
