Research graph
References from Slurry injection schemes based on flow field distribution during chemical mechanical polishing process. Local targets link to admitted publications; unresolved targets remain external evidence.
Improvement in the planarization of 4H-SiC(0001) achieved by photo-assisted chemical mechanical polishing (P-CMP) using nano TiO2-based composite abrasive with heterostructure
10.26599/frict.2025.9440993 · 2025 · External reference
Two material removal modes in chemical mechanical polishing: Mechanical plowing vs. chemical bonding
10.1007/s40544-023-0799-6 · 2024 · External reference
Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution
10.1016/j.triboint.2020.106319 · 2020 · External reference
Individual and interactive action mechanisms of mechanical, chemical, and electrical factors in Co polishing
10.26599/frict.2025.9440961 · 2025 · External reference
Novel slurry injection system for improved slurry flow and reduced defects in CMP
10.4028/www.scientific.net/ssp.219.143 · 2014 · External reference
Effect of pad groove width on slurry mean residence time and slurry utilization efficiency in CMP
10.1016/j.mee.2016.02.035 · 2016 · External reference
Morphological characteristics and formation mechanism of latent scratches in chemical mechanical polishing
10.1016/j.jmatprotec.2022.117689 · 2022 · External reference
Slurry injection schemes on the extent of slurry mixing and availability during chemical mechanical planarization
10.3390/mi8060170 · 2017 · External reference
Chemical mechanical polishing of sapphire elucidated by densely discrete phase model and verified using atomic force microscopy
10.1016/j.triboint.2024.109834 · 2024 · External reference
Novel method to visualize Preston’s coefficient distribution for chemical mechanical polishing process
10.35848/1347-4065/ac916b · 2022 · External reference
Wear behavior of copper material removal during fluid jet polishing: A comparative study between experiment and simulation
10.1007/s40544-023-0771-5 · 2024 · External reference
Experimental investigation of the influence of surface structures on hydrodynamic fluid film thickness and contact temperatures in sliding contacts
10.26599/frict.2025.9441089 · 2025 · External reference
Slurry flow visualisation of chemical mechanical polishing based on a computational fluid dynamics model
10.4028/www.scientific.net/amr.565.324 · 2012 · External reference
Numerical modeling and experimental study of thermal field and material removal for silicon wafer in final-touch polishing
10.1016/j.jmapro.2025.01.012 · 2025 · External reference
Simulation and experimental study of ultrasound-chemical synergistic mechanism for ultrasound-assisted chemical-mechanical polishing of single-crystal silicon carbide
10.1016/j.surfin.2025.107448 · 2025 · External reference
A numerical study on slurry flow with CMP pad grooves
10.1016/j.mee.2020.111437 · 2020 · External reference
Investigating the impact of pad groove depth reduction on process variation in oxide chemical mechanical polishing
10.1149/2162-8777/ad83ef · 2024 · External reference
Effect of radial grooves pads on copper chemical mechanical polishing
10.1016/j.mssp.2022.106968 · 2022 · External reference
Simulation and experimental investigation of the radial groove effect on slurry flow in oxide chemical mechanical polishing
10.3390/app12094339 · 2022 · External reference
Analysis of retaining ring using finite element simulation in chemical mechanical polishing process
10.1007/s00170-006-0622-3 · 2007 · External reference
Numerical analysis of the effect of retaining ring structure on the chemical mechanical polishing abrasive motion state
10.3390/ma16010062 · 2023 · External reference
Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization
10.1007/s00170-011-3215-8 · 2011 · External reference
Modeling and simulation for the distribution of slurry particles in chemical mechanical polishing
10.1007/s00170-014-6132-9 · 2014 · External reference
In situ investigation of slurry flow fields during CMP
10.1149/1.3223562 · 2009 · External reference
Study on the prediction of high-speed rotary lip seal wear in aero-engine based on heat-fluid-solid coupling
10.1108/ilt-10-2023-0320 · 2024 · External reference
SST turbulence model improvements: Review
2023 · External reference
Confined rotating convection with large Prandtl number: Centrifugal effects on wall modes
10.1103/physreve.89.013019 · 2014 · External reference
Heat transfer and flow characteristics in a rotating disc system
10.1252/kakoronbunshu.23.679 · 1997 · External reference
Centrifugal effects in rotating convection: Nonlinear dynamics
10.1017/s0022112009006193 · 2009 · External reference
10.1017/cbo9780511840531
10.1017/cbo9780511840531 · External reference
Attachment and detachment of particles to and from fluid interfaces
10.1016/j.cocis.2021.101560 · 2022 · External reference
Improvement of material removal rate and within wafer non-uniformity in chemical mechanical polishing using computational fluid dynamic modeling
10.3390/jmmp9030095 · 2025 · External reference
Prediction of pad wear profile and simulation of its influence on wafer polishing
10.3390/mi14091683 · 2023 · External reference
