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References from Atomic insights into material removal mechanism in chemical mechanical polishing of silicon using a developed abrasive-free slurry. Local targets link to admitted publications; unresolved targets remain external evidence.
Chemical mechanical polishing for sapphire wafers using a developed slurry
10.1016/j.jmapro.2021.01.004 · 2021 · External reference
Novel eco-friendly chemical mechanical polishing of aluminum alloy for achieving close atomic surface
10.1016/j.wear.2025.206174 · 2025 · External reference
ELID grinding of silicon wafers: A literature review
10.1016/j.ijmachtools.2006.06.001 · 2007 · External reference
Novel full-scale model verified by atomic surface and developed composite microfiber and slurry polishing system
10.1016/j.compositesb.2024.111598 · 2024 · External reference
Atomic surface on a Ni alloy produced by novel green chemical mechanical polishing
10.1016/j.triboint.2025.110902 · 2025 · External reference
Review on advanced atomic-level polishing for single crystal diamond
10.1016/j.surfin.2025.107443 · 2025 · External reference
A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics
10.1039/d3nr04420c · 2023 · External reference
A two-qubit gate between phosphorus donor electrons in silicon
10.1038/s41586-019-1381-2 · 2019 · External reference
The future transistors
10.1038/s41586-023-06145-x · 2023 · External reference
Atomic surface of silicon wafers induced by grafted silica nanoparticles and sodium carbonate
10.1016/j.apsusc.2024.160234 · 2024 · External reference
Facet-dependent oxidative fabrication of diamond determined by operando scanning electron microscopy
10.1021/acs.nanolett.5c00236 · 2025 · External reference
Atomic surface of diamond induced by novel green photocatalytic chemical mechanical polishing with high material removal rate
10.1088/2631-7990/ad97f7 · 2025 · External reference
Correction: Unprecedented developed composite polishing system to achieve atomic surface integrating rough and fine polishing using a novel hyper-conjugated pad through controlling the temperature of a proposed green slurry
10.1007/s42114-025-01328-8 · 2025 · External reference
Atomic-scale planarization surface of quartz glass induced by novel green chemical mechanical polishing using three ingredients
10.1016/j.mtsust.2024.100669 · 2024 · External reference
Atomic surface achieved through a novel cross-scale model from macroscale to nanoscale
10.1039/d3nr05278h · 2024 · External reference
Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives
10.1016/j.apsusc.2023.158382 · 2023 · External reference
Asynchronous mechanochemical atomic attrition behavior of heterogeneous polysilicon surface
10.1016/j.wear.2025.205915 · 2025 · External reference
Investigation of cleaning mechanisms for particle, metal ion, and organic contaminations in amorphous carbon post-CMP cleaning
10.1016/j.apsusc.2025.164803 · 2026 · External reference
Systematic root cause analysis of ceria-induced defects during chemical mechanical planarization and cleaning
10.1016/j.jmapro.2024.07.102 · 2024 · External reference
Role of amines and amino acids in enhancing the removal rates of undoped and P-doped polysilicon films during chemical mechanical polishing
10.1016/j.colsurfa.2010.05.026 · 2010 · External reference
Role of polycation adsorption in poly-Si, SiO2 and Si3N4 removal during chemical mechanical polishing: Effect of polishing pad surface chemistry
10.1016/j.colsurfa.2011.07.039 · 2011 · External reference
Performance of carboxyl groups in chemical mechanical polishing of GCr15 bearing steel: Effects of carbon chain length and pH
10.1007/s11249-021-01532-9 · 2021 · External reference
Dependence of pad performance on its texture in polishing mono-crystalline silicon wafers
10.1016/j.ijmecsci.2009.09.017 · 2010 · External reference
Interplay between solution chemistry and mechanical activation in friction-induced material removal of silicon surface in aqueous solution
10.1016/j.triboint.2020.106319 · 2020 · External reference
Nanoscale wear layers on silicon wafers induced by mechanical chemical grinding
10.1007/s11249-017-0911-z · 2017 · External reference
Gate-induced quantum-confinement transition of a single dopant atom in a silicon FinFET
10.1038/nphys994 · 2008 · External reference
Nanomanufacturing of silicon surface with a single atomic layer precision via mechanochemical reactions
10.1038/s41467-018-03930-5 · 2018 · External reference
Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing
10.1039/d3nr01149f · 2023 · External reference
Chemical mechanical polishing of silicon wafers using developed uniformly dispersed colloidal silica in slurry
10.1016/j.jmapro.2023.01.007 · 2023 · External reference
Study on the polishing mechanism of pH-dependent tribochemical removal in CMP of CaF2 crystal
10.1016/j.triboint.2020.106370 · 2020 · External reference
Role of tribochemistry in nanowear of single-crystalline silicon
10.1021/am201763z · 2012 · External reference
Atomic insight into tribochemical wear mechanism of silicon at the Si/SiO2 interface in aqueous environment: Molecular dynamics simulations using ReaxFF reactive force field
10.1016/j.apsusc.2016.08.082 · 2016 · External reference
Minimization of chemical-mechanical planarization (CMP) defects and post-CMP cleaning
10.1116/1.590901 · 1999 · External reference
Achieving highly selective polishing of polysilicon over oxide and nitride films via ethylenediamine-modulated interfacial mechanochemistry
10.1016/j.jmapro.2025.11.011 · 2025 · External reference
Charge density and pH effects on polycation adsorption on poly-Si, SiO2, and Si3N4 films and impact on removal during chemical mechanical polishing
10.1021/am2010114 · 2011 · External reference
Influence of the alkyl chain length of surfactant on adsorption process: A case study
10.1016/j.surfin.2020.100806 · 2021 · External reference
Role of interaction forces in controlling the stability and polishing performance of CMP slurries
10.1016/s0021-9797(03)00201-7 · 2003 · External reference
Manufacturing technologies toward extreme precision
10.1088/2631-7990/ab1ff1 · 2019 · External reference
Nanoscale tribological aspects of chemical mechanical polishing: A review
10.1016/j.apsadv.2022.100286 · 2022 · External reference
Enhanced ruthenium removal and superior surface quality via abrasive-free chemical mechanical polishing using synergistic catalysis with the H2O2/PDS/FeIII-NTA system
10.1002/smll.202410586 · 2025 · External reference
An all-electron numerical method for solving the local density functional for polyatomic molecules
10.1063/1.458452 · 1990 · External reference
Generalized gradient approximation made simple
10.1103/physrevlett.77.3865 · 1996 · External reference
Incorporation of solvent effects into density functional calculations of molecular energies and geometries
10.1063/1.469990 · 1995 · External reference
Hydrogen bonding and stacking interactions of nucleic acid base pairs: A density-functional-theory based treatment
10.1063/1.1329889 · 2001 · External reference
Accurate description of van der Waals complexes by density functional theory including empirical corrections
10.1002/jcc.20078 · 2004 · External reference
The synchronous-transit method for determining reaction pathways and locating molecular transition states
10.1016/0009-2614(77)80574-5 · 1977 · External reference
In situ measure of intrinsic bond strength in crystalline structures: Local vibrational mode theory for periodic systems
10.1021/acs.jctc.8b01279 · 2019 · External reference
LModeA-nano: A PyMOL plugin for calculating bond strength in solids, surfaces, and molecules via local vibrational mode analysis
10.1021/acs.jctc.1c01269 · 2022 · External reference
An ab initio cluster study of the structure of the Si(001) surface
10.1063/1.480930 · 2000 · External reference
Charge redistribution in mechanochemical reactions for solid interfaces
10.1021/acs.nanolett.4c00457 · 2024 · External reference
Nitridation of Si(100)-(2×1) surface by NH3: A quantum chemical cluster model study
10.1103/physrevlett.88.076106 · 2002 · External reference
Polished TFT’s: Surface roughness reduction and its correlation to device performance improvement
10.1109/16.556156 · 1997 · External reference
10.1201/9781315380476
10.1201/9781315380476 · External reference
Silicon wafer CMP slurry using a hydrolysis reaction accelerator with an amine functional group remarkably enhances polishing rate
10.3390/nano12213893 · 2022 · External reference
The affinity of Si–N and Si–C bonding in amorphous silicon carbon nitride (a-SiCN) thin film
10.1016/j.diamond.2004.10.045 · 2005 · External reference
Preparation of silicon carbide nitride films on Si substrate by pulsed high-energy density plasma
10.1016/s1005-8850(06)60057-1 · 2006 · External reference
Recovery of silicon from sewage sludge for production of high-purity nano-SiO2
10.1016/j.chemosphere.2012.10.087 · 2013 · External reference
XPS studies of SiO2/Si system under external bias
10.1021/jp022003z · 2003 · External reference
An XPS study of Si as it occurs in adsorbents, catalysts, and thin films
10.1016/0378-5963(83)90003-x · 1983 · External reference
The role of Nx–Si–Oy bonding configuration in acquiring strong blue to red photoluminescence from amorphous SiNxOy film
10.1139/cjp-2013-0609 · 2014 · External reference
Nanoscale wear triggered by stress-driven electron transfer
10.1021/acs.nanolett.3c01714 · 2023 · External reference
Reaction of water with hydrofluoric acid treated silicon(111) and (100) surfaces
10.1116/1.575845 · 1989 · External reference
Reaction of water on silica surfaces
10.1016/j.cossms.2006.02.001 · 2006 · External reference
Selective polishing of polysilicon during fabrication of microelectro-mechanical systems devices
10.1149/1.3111811 · 2009 · External reference
