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References from Research on Life Prediction of Key Component IGBT of the Traction Converter for Electric Multiple Units. Local targets link to admitted publications; unresolved targets remain external evidence.
Overview of fault diagnosis and fault-tolerant control methods for vehicular traction converter system
2020 · External reference
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
10.1109/jestpe.2013.2290282 · 2014 · External reference
An Industry-Based Survey of Reliability in Power Electronic Converters
10.1109/tia.2011.2124436 · 2011 · External reference
10.1109/icems.2019.8921639
10.1109/icems.2019.8921639 · External reference
Mission profile-based lifetime prediction for IGBT modules in traction inverter application
2019 · External reference
A Mapping Method of Solder Layer Fatigue Stress and Remaining Useful Life for IGBT Module in a Traction Converter Based on the Mission Profile
2022 · External reference
Unresolved reference
External reference
Unresolved reference
External reference
A Data-Driven Approach to Predict the Impact of Void Characteristics on IGBT Junction Temperature
10.1109/ted.2026.3670798 · 2026 · External reference
Unresolved reference
External reference
Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
10.1109/tpel.2014.2346485 · 2015 · External reference
10.3390/mi16091023
10.3390/mi16091023 · External reference
Unresolved reference
External reference
10.3390/electronics14244899
10.3390/electronics14244899 · External reference
Temperature-level effect on solder lifetime during thermal cycling of power modules
10.1109/tdmr.2008.2002354 · 2008 · External reference
Lifetime evaluation of IGBT module considering fatigue accumulation of solder layers
2018 · External reference
Auxiliary Particle Filtering-Based Estimation of Remaining Useful Life of IGBT
10.1109/tie.2017.2740856 · 2018 · External reference
Study on the Influence of the Deformation of Solder Layer on the Resistance of IGBT
2015 · External reference
Effects of Void Area in Solder Layer on Resistance and Thermal Impedance of Power Devices
2010 · External reference
10.1109/icept.2009.5270605
10.1109/icept.2009.5270605 · External reference
10.3390/electronics15010121
10.3390/electronics15010121 · External reference
Study of bonding wire failure effects on external measurable signals of IGBT module
10.1109/tdmr.2012.2200485 · 2014 · External reference
Research on defect criteria for ultrasonic testing of IGBT modules
2022 · External reference
Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service
2022 · External reference
Power cycling lifetime of high power IGBT modules for traction applications
1997 · External reference
10.1109/icems.2019.8921639
10.1109/icems.2019.8921639 · ExternalCitation · doi-reference
10.1109/icept.2009.5270605
10.1109/icept.2009.5270605 · ExternalCitation · doi-reference
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
10.1109/jestpe.2013.2290282 · ExternalCitation · doi-reference
Temperature-level effect on solder lifetime during thermal cycling of power modules
10.1109/tdmr.2008.2002354 · ExternalCitation · doi-reference
Study of bonding wire failure effects on external measurable signals of IGBT module
10.1109/tdmr.2012.2200485 · ExternalCitation · doi-reference
A Data-Driven Approach to Predict the Impact of Void Characteristics on IGBT Junction Temperature
10.1109/ted.2026.3670798 · ExternalCitation · doi-reference
An Industry-Based Survey of Reliability in Power Electronic Converters
10.1109/tia.2011.2124436 · ExternalCitation · doi-reference
Auxiliary Particle Filtering-Based Estimation of Remaining Useful Life of IGBT
10.1109/tie.2017.2740856 · ExternalCitation · doi-reference
Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
10.1109/tpel.2014.2346485 · ExternalCitation · doi-reference
10.3390/electronics14244899
10.3390/electronics14244899 · ExternalCitation · doi-reference
10.3390/electronics15010121
10.3390/electronics15010121 · ExternalCitation · doi-reference
10.3390/mi16091023
10.3390/mi16091023 · ExternalCitation · doi-reference
