Abstract
The widespread adoption of high-frequency power electronic converters, particularly those utilizing wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN), has significantly escalated electromagnetic interference (EMI) challenges. Driven by ultra-fast switching transitions and parasitic coupling, these EMI disturbances now span wider frequency ranges. This review highlights that conventional, filter-only mitigation strategies are increasingly inadequate for modern, high-power-density converters. Instead, effective EMI suppression requires a coordinated, multilayer approach incorporating source-level suppression, propagation-path control, layout-aware engineering, and soft-switching strategies. Additionally, the analysis shows that hybrid modeling frameworks—integrating time and frequency-domain methods—offer superior EMI characterization compared to standalone approaches. Looking forward, AI-assisted EMI prediction and compact integrated filters represent critical research directions. Unlike traditional surveys that focus narrowly on conducted EMI or filter-based fixes, this review introduces a unified "source–path–system" framework. By integrating conducted and radiated EMI mechanisms, addressing WBG-specific challenges, and evaluating system-level mitigation trade-offs, this paper provides a comprehensive guide for designing next-generation, electromagnetic compatibility (EMC) -compliant power electronic platforms.