Abstract
The intrinsic stresses introduced during the MEMS multilayer deposition process and the thermal stresses introduced during operation can significantly impact the performance, reliability, and lifetime of the product. The mechanical properties of the MEMS multilayer system are analyzed. An accurate closed-form solution is obtained for the multilayer system, including both intrinsic stresses and thermal stresses, and validated by numerical FEM simulation. Thin films are deposited on silicon substrates, and wafer bending measurements are carried out. Based on this formalism, the residual stresses in various multilayer systems are extracted and analyzed using parameter estimation theory.