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Privacy-aware community infrastructureNandish Pai, Vardhan Mittal, Venugopal Arumuru
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10.1016/j.enconman.2014.10.045 · doi-reference
Experimental investigation of multiwall carbon nanotube/paraffin based heat sink for electronic device thermal management
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Numerical simulation of plate fin heat sinks filled with low-melting metal PCM for high heat flux chips
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Performance evaluation and optimization of data center servers using single-phase immersion cooling
10.1016/j.ijheatmasstransfer.2023.125057 · doi-reference
Optimization and comprehensive evaluation of liquid cooling tank for single-phase immersion cooling data center
10.1016/j.applthermaleng.2024.122864 · doi-reference
Investigation of PCM-assisted heat pipe for electronic cooling
10.1016/j.applthermaleng.2017.08.109 · doi-reference
Heat pipe for cooling of electronic equipment
10.1016/j.enconman.2008.05.002 · doi-reference
Thermal performance of pin fin heat sinks with phase change material for electronic devices thermal management
10.1016/j.applthermaleng.2024.123456 · doi-reference
Experimental and numerical investigation of a phase change material: thermal-energy storage and release
10.1016/j.apenergy.2011.01.036 · doi-reference
Cooling of mobile electronic devices using phase change materials
10.1016/j.applthermaleng.2003.09.005 · doi-reference
Phase change materials for thermal management and energy storage: a review
10.1016/j.est.2022.105602 · doi-reference
Recent advances in thermal interface materials for thermal management of high-power electronics
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