Abstract
No public abstract is available from the verified source records.
Contact and support
Need help, have a question, or want to contact the ResearchHub team?
© 2026 ResearchHub. Built for responsible scholarly connection.
Privacy-aware community infrastructureGuiqi Hou, Liwei Lu, Fantao Zeng, Yejie Jiang, Xiaoqing Zhang, Wei Yuan
Abstract
Authors
Institutions
No ROR-resolved institution is linked to this work yet.
Provenance
crossref
Confidence 100%
openalex
Confidence 95%
datacite
Confidence 0%
No local reference links have been materialized yet.
No local citing links have been materialized yet.
LED thermal management: From fundamental mechanisms to deep learning-enabled multi-objective optimization for sustainable lighting
10.1016/j.rser.2026.116980 · 2026
High-performance thermal management system for high-power LEDs based on double-nozzle spray cooling
10.1016/j.applthermaleng.2023.121005 · 2023
Heat and fluid flow in high-power LED packaging and applications
10.1016/j.pecs.2016.05.003 · 2016
Application of micro/nano technology for thermal management of high–power LED packaging – A review
10.1016/j.applthermaleng.2018.09.078 · 2018
Thermal management of LEDs: package to system
2004
Measuring and prognosis of remaining useful life of light-emitting diodes based on nonlinear fuzzy inference system
10.1016/j.measurement.2026.120322 · 2026
Light emitting diode degradation and failure occurrence modelling based on accelerated life test
10.1016/j.engfailanal.2024.109200 · 2025
Parametric modeling and thermal optimization of novel bionic heat sinks inspired by leaf venation
10.1016/j.ijheatmasstransfer.2025.127940 · 2026
Investigation of the cooling performance of a double-layer liquid-cooled plate with circular arc-shaped flow channels for thermal management of light-emitting diodes
10.1016/j.ijthermalsci.2023.108756 · 2024
Improvement of heat sink cooling performance by optimizing geometrical parameters: role of fin number, height, and angle
10.1016/j.icheatmasstransfer.2025.109859 · 2025
Heat-dissipation performance of cylindrical heat sink with perforated fins
10.1016/j.ijthermalsci.2021.107132 · 2021
Design of fins with a grooved heat pipe for dissipation of heat from high-powered automotive LED headlights
10.1016/j.enconman.2018.11.021 · 2019
Experimental investigation on active heat sink with heat pipe assistance for high-power automotive LED headlights
10.1016/j.csite.2021.101503 · 2021
Multi-objective optimization of a cylindrical heat sink with straight and forked fins using artificial neural network (ANN)
10.1016/j.icheatmasstransfer.2025.109082 · 2025
Optimization of delta ribs in a microchannel heat sink using numerical analysis and Artificial Neural Networks
10.1016/j.csite.2025.107167 · 2025
Residual-based physics-informed transfer learning: A hybrid method for accelerating long-term CFD simulations via deep learning
10.1016/j.ijheatmasstransfer.2023.124900 · 2024
Computationally effective machine learning approach for modular thermal energy storage design
10.1016/j.apenergy.2024.124430 · 2025
A Review of Data-Driven Models for Electromagnetic Devices Design and Analysis
10.1109/access.2025.3591965 · 2025
Improved Cauer thermal network considering thermal coupling effects of multi-chip modules
10.1049/iet-pel.2020.0001 · 2020
Decoupling compact thermal model in multi-chip IGBT modules: A methodology based on concepts of positive and negative mutual thermal coupling
10.1109/jestpe.2024.3377913 · 2024
Frequency-domain thermal coupling model of multi-chip power module
10.1109/tpel.2023.3236250 · 2023
A Method to Derive the Coupling Thermal Resistances at Junction-to-Case Level in Multichip Power Modules
10.1109/tpel.2022.3207140 · 2023
Physics-based thermal impedance model for power module by analytic Fourier series based heat spreading angle
2022
Lumped thermal coupling model of multichip power module enabling case temperature as reference node
10.1109/tpel.2022.3173653 · 2022
A modeling method for thermal steady-state simulation of the four-layer printed circuit board
10.1371/journal.pone.0310237 · 2024
A thermal network model for multichip power modules enabling to characterize the thermal coupling effects
10.1109/tpel.2024.3355207 · 2024
Junction temperature prediction for multi-chip IGBT modules based on an improved 3D thermal network model and experimental results
10.1016/j.rineng.2025.106072 · 2025
Three-dimensional multi-scale topology optimization of porous heat sink with predetermined unit cells for natural convection heat transfer
10.1016/j.ijheatmasstransfer.2024.125398 · 2024
Experimental investigation of an additively manufactured cold plate for multi-chip module cooling generated using the homogenization approach to topology optimization
10.1016/j.applthermaleng.2024.124741 · 2025
Thermo-electrochemical level-set topology optimization of a heat exchanger for lithium-ion batteries for electric vertical take-off and landing vehicles
10.1016/j.applthermaleng.2024.123461 · 2024
Comparative study on topology optimization of microchannel heat sink by using different multi-objective algorithms and objective functions
10.1016/j.applthermaleng.2024.123606 · 2024
Data-driven multi-fidelity topology design of fin structures for latent heat thermal energy storage
10.1016/j.apenergy.2024.124596 · 2025
Data-driven multifidelity topology design for enhancing turbulent natural convection cooling
10.1016/j.ijheatmasstransfer.2024.126659 · 2025
Conduction-driven cooling of LED-based automotive LED lighting systems for abating local hot spots
10.1117/1.oe.57.2.025102 · 2018
No additional external references are available.