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Jayathi Murthy, S.C. Yao, Sreekant Narumanchi, Chi-Fu Wu, Cheng-Chieh Hsieh
Abstract
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1994
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Heat and mass transfer between impinging gas jets and solid surfaces
10.1016/s0065-2717(08)70221-1 · 1977
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10.1115/1.2910675 · 1993
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1992
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1998
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10.1115/1.2910883 · 1994
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10.1115/1.2910582 · 1991
Unresolved referenced work
1990
Unresolved referenced work
1994
Dynamic model of enhancement boiling heat transfer on porous surfaces, Part I: experimental investigation
10.1115/1.3244320 · 1980
Unresolved referenced work
Kept as external metadata until matched
Effect of material composition and localized heat generation on time-dependent conjugate heat transport
10.1016/0017-9310(94)00292-4 · doi-reference
Spectral element – Fourier method for unsteady conjugate heat transfer in complex geometry flows
10.2514/3.653 · doi-reference
Spectral element – Fourier method for transitional flows in complex geometries
10.2514/3.49002 · doi-reference
A spectral element method for fluid dynamics: Laminar flow in a channel expansion
10.1016/0021-9991(84)90128-1 · doi-reference
Transient thermal management of temperature fluctuations during time varying workloads on portable electronics
10.1109/6144.814970 · doi-reference
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10.1016/s0924-4247(97)80100-8 · doi-reference
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10.1115/1.2911348 · doi-reference
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10.1115/1.2909330 · doi-reference