Abstract
Contact and support
Need help, have a question, or want to contact the ResearchHub team?
© 2026 ResearchHub. Built for responsible scholarly connection.
Mulugeta Abtew, Guna Selvaduray
Abstract
Authors
Institutions
No ROR-resolved institution is linked to this work yet.
Provenance
crossref
Confidence 100%
unpaywall
Confidence 95%
datacite
Confidence 0%
No local reference links have been materialized yet.
No local citing links have been materialized yet.
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
In search of new lead-free electronic solders
10.1007/bf02651363 · 1994
Unresolved referenced work
Kept as external metadata until matched
10.1109/iemt.1995.526121
10.1109/iemt.1995.526121
An assessment of the use of lead in electronics assembly
1993
10.1038/333134a0
10.1038/333134a0
Unresolved referenced work
Kept as external metadata until matched
Foreword
1994
10.1109/iemt.1995.526121
10.1109/iemt.1995.526121
Unresolved referenced work
Kept as external metadata until matched
Microstructure and mechanical properties of Pb-free solder alloys for low cost electronic assembly: a review
10.1007/bf02651361 · 1994
Unresolved referenced work
Kept as external metadata until matched
Metals demand in telecommunication
1986
Unresolved referenced work
Kept as external metadata until matched
10.1109/iemt.1995.526121
10.1109/iemt.1995.526121
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Metallurgy of low temperature Pb-free solders for electronic assembly
10.1179/imr.1995.40.2.65 · 1995
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Improved mechanical properties in new, Pb-free solder alloys
10.1007/bf02651364 · 1994
10.1007/bf03222376
10.1007/bf03222376
Phase relationships in Bi–In–Sn alloy systems
10.1179/mst.1986.2.10.985 · 1986
The characterization of eutectic structure
10.1098/rspa.1973.0111 · 1973
Unresolved referenced work
Kept as external metadata until matched
New Pb-free solder alloy with superior mechanical properties
10.1063/1.109734 · 1993
10.1109/isee.1995.514970
10.1109/isee.1995.514970
Superplastic creep of low melting point solder joints
10.1007/bf02660403 · 1992
Microstructure and creep of indium/tin on Cu and Ni substrates
10.1007/bf02655434 · 1992
10.1108/eb037812
10.1108/eb037812
Metallurgy of low temperature Pb-free solders for electronic assembly
10.1179/imr.1995.40.2.65 · 1995
Unresolved referenced work
Kept as external metadata until matched
Wave soldering with a low melting point Bi–Sn alloy: effects of soldering temperatures and circuit board finishes
10.1007/bf02659914 · 1996
10.1109/3476.681391
10.1109/3476.681391 · doi-reference
10.1109/iemt.1995.526123
10.1109/iemt.1995.526123 · doi-reference
10.1007/978-94-011-6050-6
10.1007/978-94-011-6050-6 · doi-reference
The mechanical properties and microstructures of copper and brass joints soldered with eutectic tin–bismuth solder
10.1007/bf01132413 · doi-reference
Dependence of Cu/Sn and Cu/60Sn40Pb solder joint strength on diffusion controlled growth of Cu3Sn and Cu6Sn5
10.1557/proc-40-129 · doi-reference
10.1080/00202967.1976.11870376
10.1080/00202967.1976.11870376 · doi-reference
Effects of Fe, Ni, and Sn on reaction diffusion at solder/Cu base alloy interface
10.2320/jinstmet1952.48.9_863 · doi-reference
Interdiffusion and reaction in bimetallic Cu–Sn thin films
10.1016/s0254-0584(97)80016-8 · doi-reference
Evaluation of lead-free joints in electronic assemblies
10.1007/bf02651370 · doi-reference
Issues in the replacement of lead-bearing solders
10.1007/bf03222374 · doi-reference
10.1109/iemt.1992.639908
10.1109/iemt.1992.639908 · doi-reference
Alternative solders for electronics assemblies
10.1108/eb046210 · doi-reference
10.1179/mst.1987.3.12.1040
10.1179/mst.1987.3.12.1040 · doi-reference
Measurement of solder-flux-vapor surface tension by a modified maximum bubble pressure technique
10.1063/1.1134615 · doi-reference
10.1149/1.2428700
10.1149/1.2428700 · doi-reference
New lead-free, Sn–Zn–In solder alloys
10.1007/bf02653357 · doi-reference
A viable tin–lead solder substitute: Sn–Ag–Cu
10.1007/bf02653344 · doi-reference
Progress in the design of new lead-free solder alloys
10.1007/bf03222379 · doi-reference
Investigation of multi-component lead-free solders
10.1007/bf02651368 · doi-reference