Abstract
No public abstract is available from the verified source records.
Contact and support
Need help, have a question, or want to contact the ResearchHub team?
© 2026 ResearchHub. Built for responsible scholarly connection.
Privacy-aware community infrastructureK.N Tu, K Zeng
Abstract
Authors
Institutions
No ROR-resolved institution is linked to this work yet.
Provenance
crossref
Confidence 100%
unpaywall
Confidence 95%
datacite
Confidence 0%
No local reference links have been materialized yet.
No local citing links have been materialized yet.
Unresolved referenced work
Kept as external metadata until matched
Solid logic technology: versatile, high performance microelectronics
10.1147/rd.441.0056 · 2000
Controlled collapse reflow chip joining
10.1147/rd.133.0239 · 1969
SLT device metallurgy and its monolithic extensions
10.1147/rd.133.0226 · 1969
10.1007/978-1-4615-1389-6
10.1007/978-1-4615-1389-6
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Thin film reactions of Pb with AgAu and AgPd alloys
10.1063/1.322047 · 1975
10.1109/tchmt.1982.1136012
10.1109/tchmt.1982.1136012
Kinetics of thin film reactions between Pb and AgPd alloys
10.1063/1.324182 · 1977
Unresolved referenced work
Kept as external metadata until matched
Microstructure of phase-in Cr–Cu/Cu/Au bump-limiting-metallization and its soldering behavior with high Pb and eutectic SnPb solders
10.1063/1.120224 · 1997
Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu
10.1063/1.113975 · 1995
Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening
10.1103/physrevb.53.16027 · 1996
Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films
10.1063/1.363728 · 1996
Ripening-assisted asymmetric spalling of Cu–Sn compound spheroids in solder joints on Si wafers
10.1063/1.116013 · 1996
Size dependent dewetting and sideband reaction of eutectic SnPb on Au/Cu/Cr multilayered thin film
10.1557/jmr.1998.0152 · 1998
Metastable structures in metallurgy
10.1007/bf02648333 · 1981
Metastable phase formation in thin film reactions
10.1016/0921-5093(91)90965-p · 1991
Studies of SLT chip terminal metallurgy
10.1147/rd.133.0286 · 1969
Direct correlation between mechanical failure and metallurgical reaction in flip chip solder joints
10.1063/1.369779 · 1999
Interfacial morphology and shear deformation of flip chip solder joints
10.1557/jmr.2000.0242 · 2000
Microstructure–electromigration correlation in a thin stripe of eutectic SnPb solder stressed between Cu electrodes
10.1063/1.124276 · 1999
Unresolved referenced work
Kept as external metadata until matched
Interface diffusion in eutectic Pb–Sn solder
10.1016/s1359-6454(98)00348-6 · 1999
Electric current effects upon the Sn/Cu and Sn/Ni interfacial reactions
10.1007/s11664-998-0068-5 · 1998
The growth of Cu–Sn intermetallics at a pretinned copper/solder interface
10.1007/bf02665064 · 1992
The formation of Cu3Sn intermetallic on the reaction of copper with 95Pb5Sn solder
10.1007/bf02661885 · 1986
Unresolved referenced work
Kept as external metadata until matched
Algebraic representation of thermodynamic properties and the classification of solutions
10.1021/ie50458a036 · 1948
10.1007/978-1-4684-1440-0_4
10.1007/978-1-4684-1440-0_4
Thermodynamic study of phase equilibria in the Pb–Sn–Sb system
10.1007/bf02645349 · 1995
Thermodynamic assessment of the Cu–Sn system
1996
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Unresolved referenced work
Kept as external metadata until matched
Thermodynamic considerations in the analysis of phase stability: the role of interfacial equilibrium in the determination of phase diagrams by X-ray microanalytical techniques
10.1007/bf02869262 · 1987
Second phase dissolution
10.1007/bf02663326 · 1971
Unresolved referenced work
Kept as external metadata until matched
Use of multicomponent phase diagrams for predicting phase evolution in solder/conductor systems
10.1007/s11664-001-0212-y · 2001
10.7567/jjaps.2s1.633
10.7567/jjaps.2s1.633 · doi-reference
Single intermetallic compound formation in PdPb and PdSn thin-film couples studied by X-ray diffraction
10.1016/0167-577x(82)90029-5 · doi-reference
Development of under bump metallizations for flip chip bonding to organic substrates
10.1007/s11664-999-0149-0 · doi-reference
Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization
10.1063/1.371967 · doi-reference
Morphology of wetting reactions of SnPb alloys on Cu as a function of alloy composition
10.1557/jmr.1998.0006 · doi-reference
10.1109/iemte.1998.723081
10.1109/iemte.1998.723081 · doi-reference
10.1109/ectc.1999.776214
10.1109/ectc.1999.776214 · doi-reference
Inhibiting growth of the Au0.5Ni0.5Sn4 intermetallic layer in Pb–Sn solder joints reflowed on Au/Ni metallization
10.1007/s11664-000-0009-4 · doi-reference
Growth of a Au–Ni–Sn intermetallic compound on the solder–substrate interface after aging
10.1007/s11661-000-0022-5 · doi-reference
Formation and resettlement of (AuxSn1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish
10.1007/s11664-000-0010-y · doi-reference
10.1109/iemt.1999.804791
10.1109/iemt.1999.804791 · doi-reference
10.1109/iemt.1999.804790
10.1109/iemt.1999.804790 · doi-reference
Constitution of AuSn–Pb–Sn partial ternary system
10.1179/mst.1985.1.6.433 · doi-reference
Reaction kinetics of solder balls with pads in BGA packages during reflow soldering
10.1007/s11664-999-0162-3 · doi-reference
Diffusion controlled reactions in Au/Pb–Sn solder system
10.1179/mst.1992.8.9.817 · doi-reference
Constitution of Au–AuSn–Pb partial ternary system
10.1179/mst.1987.3.8.621 · doi-reference
Morphology of wetting reaction of eutectic SnPb solder on Au foils
10.1063/1.363336 · doi-reference
The Au–Pb–Sn ternary system
10.1016/0022-5088(67)90094-x · doi-reference
Time- and temperature-dependent wetting behavior of eutectic SnPb on Cu leadframes plated with Pd/Ni and Au/Pd/Ni thin films
10.1063/1.368136 · doi-reference
Soldering reaction between eutectic SnPb and plated Pd/Ni thin films on Cu leadframe
10.1063/1.120434 · doi-reference
Thermodynamic modeling of the Pd–Pb–Sn system
10.1007/s11661-999-0191-9 · doi-reference
Interfacial microstructure and the kinetics of interfacial reaction in diffusion couples between SnPb solder and Cu/Ni/Pd metallization
10.1016/s1359-6454(00)00165-8 · doi-reference
Diffusion and phase transformations during interfacial reaction between lead–tin solders and palladium
10.1007/s11664-998-0064-9 · doi-reference
Ultrafast intermetallic compound formation between eutectic SnPb and Pd where the intermetallic is not a diffusion barrier
10.1063/1.114467 · doi-reference
Kinetic analysis of interfacial diffusion accompanied by intermetallic compound formation
10.1063/1.370880 · doi-reference
Morphology of interfacial reaction between Pb-free solders and electroless Ni(P) under-bump-metallization
10.1063/1.1321787 · doi-reference
Growth of intermetallic compounds on common basis material coated with tin or tin–lead alloys
10.1080/00202967.1976.11870376 · doi-reference
Solder bump formation using electroless plating and ultrasonic soldering
10.1109/33.52858 · doi-reference
Kinetics of interfacial reaction between eutectic SnPb solder and Cu/Ni/Pd metallizations
10.1007/s11664-999-0163-2 · doi-reference
Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology
10.1063/1.370627 · doi-reference
Preparation of solder bumps incorporating electroless nickel–boron deposit and investigation on the interfacial interaction behavior and wetting kinetics
10.1023/a:1018599609177 · doi-reference
The interaction kinetics and compound formation between electroless Ni–P and solder
10.1016/0040-6090(94)90761-7 · doi-reference
10.1557/proc-40-123
10.1557/proc-40-123 · doi-reference
Thermodynamic modeling of the Ni–Pb–Sn system
10.1007/s11661-999-0085-x · doi-reference
Fast dissolution and soldering reactions on Au foils
10.1016/s0254-0584(97)02076-2 · doi-reference
Rapid soldering reactions of eutectic SnPb and eutectic SnBi on palladium surfaces
10.1016/0956-716x(95)00095-d · doi-reference
Morphology of instability of the wetting tips of eutectic SnBi, eutectic SnPb, and pure Sn on Cu
10.1557/jmr.1995.0497 · doi-reference
Reactive flow of molten Pb(Sn) alloys in Si grooves coated with Cu film
10.1103/physreve.58.6308 · doi-reference
Flow of simple liquids down narrow V grooves
10.1103/physreve.52.3967 · doi-reference
A study of solute diffusion in liquid tin
10.1016/0001-6160(60)90008-0 · doi-reference