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Chunxing Pei, Jianqiang Liu, Xuan Feng, Yunhe Liu
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Overview of fault diagnosis and fault-tolerant control methods for vehicular traction converter system
2020
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
10.1109/jestpe.2013.2290282 · 2014
An Industry-Based Survey of Reliability in Power Electronic Converters
10.1109/tia.2011.2124436 · 2011
10.1109/icems.2019.8921639
10.1109/icems.2019.8921639
Mission profile-based lifetime prediction for IGBT modules in traction inverter application
2019
A Mapping Method of Solder Layer Fatigue Stress and Remaining Useful Life for IGBT Module in a Traction Converter Based on the Mission Profile
2022
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A Data-Driven Approach to Predict the Impact of Void Characteristics on IGBT Junction Temperature
10.1109/ted.2026.3670798 · 2026
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Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
10.1109/tpel.2014.2346485 · 2015
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10.3390/mi16091023
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10.3390/electronics14244899
10.3390/electronics14244899
Temperature-level effect on solder lifetime during thermal cycling of power modules
10.1109/tdmr.2008.2002354 · 2008
Lifetime evaluation of IGBT module considering fatigue accumulation of solder layers
2018
Auxiliary Particle Filtering-Based Estimation of Remaining Useful Life of IGBT
10.1109/tie.2017.2740856 · 2018
Study on the Influence of the Deformation of Solder Layer on the Resistance of IGBT
2015
Effects of Void Area in Solder Layer on Resistance and Thermal Impedance of Power Devices
2010
10.1109/icept.2009.5270605
10.1109/icept.2009.5270605
10.3390/electronics15010121
10.3390/electronics15010121
Study of bonding wire failure effects on external measurable signals of IGBT module
10.1109/tdmr.2012.2200485 · 2014
Research on defect criteria for ultrasonic testing of IGBT modules
2022
Research on solder layer void evolution mechanism for IGBT module of electric locomotive in service
2022
Power cycling lifetime of high power IGBT modules for traction applications
1997
Study of bonding wire failure effects on external measurable signals of IGBT module
10.1109/tdmr.2012.2200485 · doi-reference
10.3390/electronics15010121
10.3390/electronics15010121 · doi-reference
10.1109/icept.2009.5270605
10.1109/icept.2009.5270605 · doi-reference
Auxiliary Particle Filtering-Based Estimation of Remaining Useful Life of IGBT
10.1109/tie.2017.2740856 · doi-reference
Temperature-level effect on solder lifetime during thermal cycling of power modules
10.1109/tdmr.2008.2002354 · doi-reference
10.3390/electronics14244899
10.3390/electronics14244899 · doi-reference
10.3390/mi16091023
10.3390/mi16091023 · doi-reference
Physics-of-Failure, Condition Monitoring, and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review
10.1109/tpel.2014.2346485 · doi-reference
A Data-Driven Approach to Predict the Impact of Void Characteristics on IGBT Junction Temperature
10.1109/ted.2026.3670798 · doi-reference
10.1109/icems.2019.8921639
10.1109/icems.2019.8921639 · doi-reference
An Industry-Based Survey of Reliability in Power Electronic Converters
10.1109/tia.2011.2124436 · doi-reference
Transitioning to Physics-of-Failure as a Reliability Driver in Power Electronics
10.1109/jestpe.2013.2290282 · doi-reference